California Inventors Develop Optoelectronic Package

ALEXANDRIA, Va., April 18 -- Marc A. Finot of Palo Alto, Calif., and Xiaowei Yao of San Jose, Calif., have developed an optical package fiber.

According to the U.S. Patent & Trademark Office: "Optoelectronic packages with one or more feed-throughs having a cutout allow optical fibers that have been coupled to a component (e.g., an optical component, an electrical component, a structural component) to be fed through more easily than a package having feed-throughs without a cutout. In one embodiment, the cut in the feed-through is on the opposite side of the initial direction of the threading. That is, if the fiber is to come from above the feed-through, the cut is placed on the bottom of the feed-through. The placement of the cut on the feed-through allows a fiber previously attached to a component to be fed through without excessive curvature of the fiber."

The inventors were issued U.S. Patent No. 7,350,987 on March 25.

The patent has been assigned to Intel Corp., Santa Clara, Calif.

The original application was filed on Sept. 30, 2002, and is available at: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=7,350,987.PN.&OS=PN/7,350,987&RS=PN/7,350,987.

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