NEXX Systems Launches New APOLLO Sputter Deposition System

NEXX Systems, a leading provider of processing equipment for advanced wafer-level packaging applications, today announced the product launch of its new Apollo sputter deposition system. The Apollo advances the state-of-the-art in metal deposition for wafer level packaging due to its remarkable versatility, excellent performance, and low cost of ownership. The Apollo is ideally suited for applications including under bump metallization, redistribution layers, backside metallization, integrated passives, LEDs.. In addition, the Apollo is ideally suited for the metallization process required to produce solar panels, a growing application in today's initiatives for alternative energy production. Both the packaging and solar industries are driven to employ the most reliable and cost-effective solutions available for their metallization needs.

"The Apollo represents the culmination of nearly twenty years of technological advances in sputter deposition," stated John Bowers, vice president of customer operations at NEXX Systems. "This system really sets a new standard for faster, more economical processing of the critical metal layers requisite to tomorrow's electronic and solar devices."

The Apollo platform offers:

The Apollo software affords extremely flexible operation. Incorporating a field-proven, Ethernet-based, distributed control system, the Apollo is able to integrate wafer mapping and alignment at all wafer sizes. MiniBatch software permits the user to process a recipe by batch or by cassette.

About NEXX: NEXX Systems brings exceptional technical expertise to the flip chip and advanced packaging markets. Our product lines provide the most efficient, yet affordable, systems of their kind: Apollo and Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. Additional information can be found at:www.nexxsystems.com.