Japanese Inventor Develops Substrate Manufacturing Method

ALEXANDRIA, Va., April 23 -- Ryuji Komatsu of Okaya, Japan, has developed a method of manufacturing a substrate.

According to the U.S. Patent & Trademark Office: "The present invention provides to a substrate for a semiconductor device, in which electric characteristics to high-speed signals are enhanced by facilitating the mounting of a circuit component, such as a decoupling capacitor, fabricated separately from the substrate. The substrate for a semiconductor device, on which the circuit component, such as a decoupling capacitor, can be mounted, is counterbored from the mounting surface side thereof, and a component mounting hole where a connection terminal, which will be electrically connected to the circuit component, is exposed in the inner bottom face is made by counterboring. The circuit component is mounted and electrically connected to the connection terminal, and a semiconductor element is mounted on the substrate by flip-chip connection."

The inventor was issued U.S. Patent No. 7,348,213 on March 25.

The patent has been assigned to Nihon Micron Co. Ltd., Nagano, Japan.

The original application was filed on Nov. 27, 2006, and is available at: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=7,348,213.PN.&OS=PN/7,348,213&RS=PN/7,348,213.

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