Company News
-- Semiconductor International, 5/1/2001
Applied Materials Inc. (Santa Clara, Calif.) shipped more than 300 Producer CVD systems to chipmakers worldwide. The shipment included 200 and 300 mm systems, more than 20 of which have been installed in 300 mm fabs. In addition, the company's Austin, Texas, equipment manufacturing operation was awarded ISO 9002 certification for quality assurance.Mykrolis Corp. (Bedford, Mass.), formerly Millipore Microelectronics, a division and wholly owned subsidiary of Millipore Corp., is now an independent, publicly traded company. The company will concentrate on fluid delivery systems and components for wafer processing.
Novellus Systems Inc. (San Jose) received a multisystem order for its SABRE xT electrofill system from UMC. The systems will be used for copper dual-damascene manufacturing and in ramping UMC's WorldLogic 0.13 µm, eight-layer copper/low-k process technology.
Ibis Technology Corp. (Danvers, Mass.) expanded its wafer manufacturing facility in Danvers. The 15,000 ft2 expansion, which will enable the company to increase SIMOX-SOI wafer production capacity, features an improved quality control lab.
Kulicke & Soffa Inc. (Willow Grove, Pa.) acquired the outstanding 20% equity interest in Flip Chip Technologies LLC (Phoenix) from Delco Electronics Corp. (now known as Delphi Delco Electronics Systems).
Process Integration LLC (Gilbert, Ariz.) purchased the assets of Mantis Robotics Corp. All assets, products, designs, trademarks, patents and intellectual property were included in the purchase.
KLA-Tencor Corp. (San Jose) and Samsung Electronics completed their joint wafer inspection evaluation of KLA's 2350 UV high-resolution imaging wafer inspection tool, which was used to monitor the production of advanced DRAM devices. The tool is installed in Samsung's RS fab in Kiheung, Korea.
Autosplice Inc. (San Diego) received ISO 9001 and QS 9000 certification. The National Standards Authority of Ireland provided the independent audit and certification.
ULVAC Technologies Inc. (Methuen, Mass.) is part of a cooperative effort with International SEMATECH. ULVAC's IW-630 implanter will be used to create 100 nm baseline processes.
ASM America (Phoenix) delivered multiple Epsilon E2000 single-wafer epitaxial processing tools to Texas Instruments. The tools will be used to support TI's production of advanced mixed-signal devices at its Dallas and Freising, Germany, facilities.
Microsemi Corp. (Santa Ana, Calif.) began shipping its first GaAs semiconductors three months ahead of schedule. Initial orders are for the company's InGaAs/InP photodetectors, which will be used for dense wavelength division multiplexing optical transponder applications.
SemiTest Inc. (Billerica, Mass.) shipped one of its SCA-3000 surface charge analyzer systems to a 300 mm wafer fab in Japan. The system will be used to monitor the 300 mm wafer manufacturing process.
Scott Specialty Gases (Plumsteadville, Pa.) was awarded ISO 9002 certification from SGS International Certification Services Inc.
Jusung Engineering Ltd. (Kwangju, Korea) received an order for its 200 mm BST/Ru/anneal system from two device makers in Japan.
Micronic Laser Systems AB (Taby, Sweden) placed an order with Image Technology for two advanced packaging systems, with an option to purchase an additional system.
RKC Instrument (South Bend, Ind.) purchased the SYSCON-RKC division of SYSCON International. RKC acquired all of the division's assets and accounts receivable for an undisclosed sum.
Ashland Specialty Chemical Co. (Dublin, Ohio) formed Ashland Taiwan Co. Ltd. (ATCL) and opened its first application lab for technical support for its strippers and etch residue removers in Asia. ATCL will sell its photoresist stripper products in Taiwan and provide technical support throughout Asia.
