AMD Fab 30: 2001 Top Fab
Maria A. Lester, Associate Editor -- Semiconductor International, 5/1/2001
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At a Glance | | |
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First silicon on 200 mm wafers was achieved November 1998, and production of the Athlon processor using 0.18 µm CMOS technology began December 1999 at 1000 wsw. As of January, production was at 2500 wsw. This technology uses shallow trench isolation, high-performance transistors, cobalt silicide, tungsten local interconnect, and six layers of dual-inlaid copper interconnect, totaling 28 masking levels. As of May 2000, three process technologies have been qualified. Each individual process technology required approximately six months from first silicon wafer start to final production qualification.
Defect reduction
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| 1. An etch tool is being hooked up in Fab 30 cleanroom. (Source: AMD) |
In addition, the SMIF approach was used to control wafer-handling contamination and its yield effects. The factory uses a three-level design where the clean air enters the fab from the ceiling on the third level through 25% ULPA filtration, flows through the floor on the third level, and is returned on the second level. The first level is used for pumps and other supporting equipment.
The fab is separated into four protocol zones to prevent cross-contamination between the different areas of the fab (i.e. copper and non-copper areas). The protocol includes separate gowning, gloves, maintenance tools, and pods and cassettes. Also, a yield management system (YMS) helps identify yield effects through the analysis of in-line metrology data collected automatically through equipment interfaces on the metrology tools. The factory layout was designed to minimize the amount of personnel movement between areas of the fab. The layout follows a "workcell" concept that ensured that the operator would always have the process tools, metrology tools, and material handling equipment necessary to perform all process steps and supporting operations without having to leave the immediate work area.
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| 2. AMD Fab 30 in Dresden, Germany, is the first fab specifically designed for copper processing. |
| Fab 30 Classroom Areas | |||
| Clean class (Fed Std 209E) | Particle size (µm) | Floor space (m2) | Floor space (ft2) |
| Class 1 | 0.1 | 195 | 2,098 |
| Class 10 | 0.5 | 11898 | 128,022 |
| Class 100 | 0.5 | 1289 | 13,870 |
| Class 1000 | 0.5 | 2112 | 22,725 |
| Class 10K | 0.5 | 2559 | 27,535 |
Automation
New procedures were developed at AMD with the help of TRW (Redondo Beach, Calif.) to manage the automation capabilities of the hundreds of incoming tools. GEM, SMIF, auto-ID and mini-environment cleanliness was verified on every tool that was accepted. Every process and metrology tool except one minor test tool was delivered to AMD with fully integrated SMIF capability.
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| 3. Technicians work in front of the microscope in the CMP area. (Source: AMD) |
Fab 30 uses 100% real-time single-wafer tracking of production and test wafers. Wafer sorters are used throughout the factory to move wafers and verify lot integrity. Every wafer move at a wafer sorter or a tool with an EI is traced by the factory systems. This approach minimized scheduled downtime for equipment qualifications by supporting streamlined qualification procedures, and also minimized storage space requirements for test wafers by compressing them into fewer cassettes/pods.
EHS
Fab 30 is a green fab featuring a "set aside" green belt around the site. The environmental factor was considered in all major decisions such as the reduced footprint compared with Austin; the use of the more energy-efficient SMIF manufacturing concept; the reduction of PFC and VOC emissions below the legally mandated limits; and the implementation of an environmentally friendly cogeneration power plant.
Emission control systems that are in place control the process effluents to levels significantly below the air-quality standards. Chemically treated acid and caustic process exhaust systems are in place. In addition, an energy-efficient rotor concentrator/thermal oxidizer system destroys VOCs. Point-of-use abatement devices were matched to the process. There are 14 waste drain systems that allow for efficient treatment, material recovery and recycling. Collection of process waste water from first and second rinse baths contributes to the water recycling effort, which is targeted at 70% at maturity.
All of Fab 30's electrical and thermal energy requirements are provided by a specially designed cogeneration plant that uses waste heat recovered from the production of electricity for heating and cooling the fab and associated process equipment. The Energy Center employs reciprocating gas engines in a cogeneration process 30% more efficient than a conventional all-electric solution.
This environmentally friendly approach achieves an overall efficiency of energy-in vs. energy-out of 70-80% (compared with 35-40% for conventional utility solutions). The higher efficiency also contributes to a 30% reduction in CO2 emissions of >20,000 metric tons for the period Oct/98-Oct/99. The lean burn natural gas engines also produce 40% less NOX and 99% less sulfur dioxides compared with the brown coal used to produce electricity in eastern Germany. It also reduced the waste heat rejected by 30%, minimizing the impact of industrialization on the local climate. Finally, the Energy Center used absorption-type chillers to turn waste heat into chilled water.
The facility is protected from fire by a hybrid automatic sprinkler system. An early-warning smoke detection system uses photoelectric and laser technology sampling to provide the earliest possible warning of fire within the cleanroom. An extensive system of gas monitoring and leak detection is in place to alert and control leakage of process gases and fluids. Automatic and remote shutdown controls are integral to the design of the liquid chemical distribution systems. Exhausted enclosures and secondary containment are employed in the delivery of hazardous materials to protect against releases.
SEMI S2 and CE Directive compliance were required for processing equipment. Fugitive emissions from maintenance procedures that must be performed within the fab (etch chamber cleans) are controlled with local exhaust trunks. Emergency showers and eyewash stations are conveniently located adjacent to fab-level egress doors, which lead onto the roof of the second level and to the protected stair towers.
The absence of structure beyond the exterior cleanroom walls allows for the introduction of natural light and the viewing of the tranquil German countryside, thus contributing to the fab's user-friendliness.
