3-D Mask Aligner

-- Semiconductor International, 10/1/2008

The second generation of the MA300 production mask aligner has an alignment kit for creating 3-D interconnects. It enables bottom-side and IR alignment for 300 mm-based 3-D packaging lithography applications. Bottom-side alignment allows users to process double-sided structured wafers, and the IR option allows for the handling of opaque, yet IR-transparent materials. SUSS MicroTec, Garching, Germany, www.suss.com

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