DuPont Adds to Its WLP Offerings
To meet growing demand for new materials for 3-D packaging and through-silicon vias, DuPont Electronic Technologies is expanding its material offerings.
Sally Cole Johnson, Contributing Editor -- Semiconductor International, 9/29/2008 7:45:00 PM
 |
The market for WLP and related technologies is growing at double-digit rates, according to Mats J. Ehlin, global business manager of DuPont Wafer-Level Packaging. “New materials are necessary to enable new innovative packages,” he said. “We believe DuPont is in a good position to deliver the materials needed for new semiconductor packages. We’re expanding our current portfolio and putting additional resources in place for future development.”
 |
| DuPont recently expanded its wafer-level packaging product portfolio. This image shows some of the various materials used to create image sensors and through-silicon vias. (Source: DuPont) |
Advances in materials are of strategic importance. “Smaller geometries demand more highly adaptable photoresists, strippers and cleaners,” said Jim Walker, vice president of research, semiconductor manufacturing, at Gartner (Stamford, Conn.). “3-D technologies that use wafer, package and die stacking will also require more reliable polymeric materials for passivation, redistribution and dielectric applications. Integration via packaging using WLP 3-D and TSV technologies is paving the way toward meeting product cycle time, manufacturing costs, and time-to-market goals in today’s fast-paced, economically challenged world.”
DuPont’s WLP product portfolio now includes advanced removable and permanent dry film photoresists, compatible remover and cleaner chemistries, and liquid polyimide and PBO materials. The company also said that it has developed a high-performance photodielectric dry film that’s designed to provide low-temperature curing (150°C) and adhesion to silicon and glass to meet the needs of image sensor and cavity packaging, as well as 3-D wafer-to-wafer or chip-to-wafer bonding applications.
Notably, collaborations are playing an important role in the development of new packaging materials. “DuPont has a number of existing strategic partnerships in place. Key contributors include our joint-venture partners Hitachi DuPont Microsystems and DuPont Air Products Nanomaterials, as well as technology developers, regional research institutes, leading equipment suppliers, academia and consortia,” Ehlin said. “Many of these are tied directly to our customers’ technology development efforts. Some of our work with Fraunhofer IZM and IMEC has already been announced, and we expect to announce additional alliances in the future.”
DuPont’s WLP product roadmap is focused on providing materials solutions for planarization, TSV creation, cavity packaging and thin wafer handling.
Talkback
Related Content
Related Content
SPONSORED LINKS
SI Resource Center
Browse Resources by Type:
- Contamination considerations for perfluoroelastomer seals used in deposition processes
Dupont Performance Elastomers | White Paper
VIEW NOW
View More
