SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Rohm and Haas Opens Immersion R&D Facility

Rohm and Haas Electronic Materials opened an R&D facility to develop materials used in 193 nm immersion lithography. The company invested ~$60M, installing an immersion scanner, track and other tools at the company’s Advanced Technology Center (ATC) in Marlborough, Mass.

Staff -- Semiconductor International, 7/8/2008 9:03:00 AM

Weekly Top 5
Rohm and Haas Electronic Materials (Marlborough, Mass.) announced the opening of its immersion lithography facility intended to support the R&D of materials, including photoresists, anti-reflectant coatings (ARCs) and topcoats.

Celebrating the opening were (left to right): Kathleen O'Connell, associate director of R&D, Microelectronic Technologies; Julie Planchet, general manager, North America and Europe, Microelectronic Technologies; Yi Hyon Paik, vice president and business group director, Rohm and Haas Electronic Materials; Jim Fahey, vice president and business unit director, Microelectronic Technologies; and Arthur Vigeant, president of the Marlborough City Council.
Celebrating the opening were (left to right): Kathleen O'Connell, associate director of R&D, Microelectronic Technologies; Julie Planchet, general manager, North America and Europe, Microelectronic Technologies; Yi Hyon Paik, vice president and business group director, Rohm and Haas Electronic Materials; Jim Fahey, vice president and business unit director, Microelectronic Technologies; and Arthur Vigeant, president of the Marlborough City Council.

The company invested ~$60M in the new facility, which is housed in the company’s Advanced Technology Center (ATC) in Marlborough. The company installed an ASML Twinscan XT:1900Gi 193 nm scanner, a 300 mm track system, and defect and metrology tools.

Rohm and Haas installed an immersion scanner, track and metrology tools in the lithography R&D center.
Rohm and Haas installed an immersion scanner, track and metrology tools in the lithography R&D center.

Jim Fahey, president of the company’s microelectronic technologies group, said, “We now have the same equipment our leading-edge customers are using, which gives us the ability to correlate with customers and optimize our materials for their applications beyond the 45 nm node.”

The $60M investment in the ATC is in addition to the original $30M facility, which opened in 2003.

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs

Podcasts

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites