2008 Editors' Choice Best Product Awards

The Editors' Choice Best Product Awards is an annual contest hosted by Semiconductor International to find and reward the products created by companies that deliver the level of excellence needed to succeed in our industry today. The Semiconductor International staff would like to congratulate the following 19 winners presented here in alphabetical order by company. We urge all companies to nominate products and materials for the 2009 awards. A sincere thank you to all the companies that participated in the 2008 contest.

The Ensemble is a next-generation standalone multi-axis controller designed for both inspection and process tool platforms. Up to 10 axes of coordinated motion, coupled with the MP drive's compact size, control the system. The control software includes an integrated, easy-to-use graphical trajectory, data analysis and enhanced machine performance tool kit. It can control any of the company's brushless, brush or stepper motors or stages in any combination. The simple parameter interface allows for the easy integration of third-party motors and stages. Also, there is no need for users to understand a cryptic command set to generate motion. The intuitive interface allows users to begin programming immediately. Communication is performed through 10/100 Base T Ethernet or USB interfaces.

N9201A is an array structure parametric test option that provides high-throughput measurement of array test structures, reducing the time engineers need to optimize process parameters and maximize yields. When used in combination with the company's 4070 testers, a per-channel source/monitor unit (SMU) architecture is created that supports up to 40 total channels. This allows for extremely fast characterization of inline array test structures.

The Centura RP Epi reactor was specifically designed to selectively grow doped or undoped epitaxy films at reduced pressure (RP). It improves DRAM data retention time and suppresses short channel effects. In terms of transistor performance, it deposits selective SiGe to form recessed source/drains in PMOS transistors, yielding as much as >60% drive current improvement. The Centura RP Epi system is extendible beyond the 40 nm node.

The Producer APF PECVD is a system that deposits advanced patterning film (APF) by plasma-enhanced chemical vapor deposition (PECVD). It has demonstrated a self-aligned double patterning process for producing 22 nm line/space arrays with a line edge roughness of <2 nm. Film stack has a reflectivity of <0.5%. The APF chamber cleaning process is a simple oxygen clean, therefore does not require harmful gases. The system delivers up to 160 wph.

Pulsar 3000 is a third-generation thermal atomic layer deposition (ALD) reactor and bridge tool that can run 150–300 mm substrates. The single-wafer tool enables the deposition of high-k materials for transistor and capacitor products, and uniform deposition of extremely thin capping layers (<5 Å).The capping layers can be deposited in situ to eliminate any issues related to the degradation of the high-k interface caused by air breaks. The modules can be integrated on a cluster platform, and can run either serially for extreme flexibility and complex stacked film or in parallel for a high-productivity solution. Throughputs as high as 60 wph for 100 Å films have been demonstrated.

Orion is a helium ion microscope capable of providing images of ultrahigh-resolution, surface information and material contrast. It uses a beam of helium ions to image and measure. The ion beam appears to emanate from a region that is <1 Å, resulting in ion beam brightness. This makes it possible to focus the beam into a very small probe size.

Grypper BGA test sockets were designed for applications where fine-pitch BGA devices can be socketed right on the actual production or evaluation RF board without any additional PCB overhead. When the device is inserted into the socket, the arms of the contact firmly grip and cradle the solder ball, providing a solderless electrical connection. There is no cover required to hold the device in place. A tool is used to lift the device along one side or corner and peel it out of the socket contacts to remove it.

WaferSense ATS uses machine vision to see inside semiconductor equipment to help avoid wafer mishandling. It provides users with accurate wafer transfer coordinates for robotic handling while reducing equipment downtime and wafer scrap. Once inside the equipment, it targets mark wafer transfer locations and transmits their digital coordinates to the user. The ATS is available for 200 and 300 mm wafer equipment, and is accurate to ±0.1 mm (X and Y positions) and ±0.5 mm (Z position).

Kalrez 9100 is a perfluoroelastomer material used in high-performance sealing applications for 200 and 300 mm deposition processes. It was designed for low erosion and ultralow particle generation in harsh plasma environments. The seal uses a proprietary filler and cross-linking technology that results in high-quality plasma resistance and thermal stability (300°C).

The EQ-10 Series is an electrodeless Z-pinch EUV light source that produces power of 10 W into 2 at 13.5 nm. It aids in the development of infrastructure to support EUV for next-generation lithography. Current is produced by transformer action in several converging loops of plasma, which appear as closed loops supported by induced currents. The Series will be integrated into a system or beamline to research EUV resist development, EUV optics metrology and EUV mask defect inspection.

The Desk Top Micro Factory Series 56XX machine was developed for use as a wire bonder for different bonding methods. The XX indicate the different bond heads that can be mounted: 5630 for a wedge/wedge bond head; 5610 for ball bond head; and 5650 for a heavy wire bond head. Wire bonding and wire pull testing of an entire module may be performed in a single wire mode, as well as in a fully automatic mode, without operator interference. It requires <3 min and a fast change of the software program to change from one method to another.

Vertex is a multi-point toxic gas monitoring system that provides 8–72 points of continuous monitoring of gases used in semiconductor operations. Despite it's compact size, it can effectively monitor large areas; sampling points can be placed up to 400 ft from the system. The system offers detection down to ppb levels and uses a proof of detection colorimetric paper-based tape technology to meet ESH requirements.

The Smart Wafer was created for troubleshooting and monitoring wafer handling. An electronic circuit that contains an accelerometer is mounted on a regular bare silicon wafer and records the vibrations along the wafer path in the process tool. The signal is then downloaded and analyzed against a known fingerprint. It is also being used as a regular monitor and a proactive tool for effectively planning and executing mechanical maintenance. The Smart Wafer device also contains a sophisticated algorithm to detect differences between the current test and the tool's historical data. A built-in SPC tool indicates deterioration of moving parts.

Model 4200-CVU is a plug-in module for the company's 4200-SCS semiconductor characterization system. It is used to make fast and easy capacitance measurements from femto Farads to nano Farads at frequencies ranging from 10 kHz to 10 MHz. It provides users with intuitive point-and-click setup, simple cabling and built-in element models that eliminate the guesswork in obtaining valid C-V measurements. The programs operate in an open environment, allowing users to easily make modifications and customize routines. Integrated sample projects help shorten program development time.

The Piezocon gas concentration sensor and controller system corrects for concentration variations caused by changes in chemical temperature, chemical level or solid surface area, or bubbler pressure and temperature variations by precisely measureing the concentration of binary gas mixtures. Then, using closed-loop feedback, it adjusts the vapor delivery MFC setpoint three times per second to maintain a consistent precursor mass transfer rate. The system creates a safer workplace by virtually eliminating out-of-spec wafers caused by vapor concentration shifts, reducing flow-to-vent chemical waste, and decreasing test wafer usage.

Calibre nmOPC has been engineered to address new and emerging operational issues encountered in design and manufacturing below the 130 nm level. It uses OPC-specific technologies and shared Calibre operating technologies to reduce turnaround time and improve accuracy. The system mathematically replicates the photolithographic manufacturing process and reproduces simulated wafer-level image contours. It models the physics of the optic system and the physical chemistry of the resist system to predict and then correct the images on the wafer.

LEXT OLS-3100 is a laser scanning confocal technology designed for applications requiring ultraprecise measurement and observation. It features submicron imaging with accurate 3-D measurement capability. SEM samples are viewed in their actual state instead of with coatings. The technology also allows users to image through oxide layers. In addition, users are able to accurately and quickly resolve their failure analysis and quality control issues without having to perform complicated sample preparation. A resolution of 120 nm laterally and 20 nm in the Z direction is possible. Lateral repeatability is 3S=0.02 μm and Z repeatability is 3S=0.04+0.002L.

AirSentry II is an AMC designed for high-sensitivity, speed and low cost. The cell provides continuous coverage of a critical monitoring point and a central software platform for easy data acquisition and analysis. The spectrometers also offer users ppt sensitivity.

PES-2300 is a 200 mm wafer bevel etching tool. Plasma is generated on the wafer bevel area only, which makes it possible to remove the film residues and polymer without plasma damage; this increases yield by reducing killer defects. It replaces conventional wet bevel etching processes that require various toxic chemicals. An average of 2–7% improvement in device yield increase per single wafer has been achieved with the etcher.

The CR-288 concentration monitor was designed for improved monitoring and control of liquid chemicals employed in device manufacturing. Installed in the process stream or at the point of use where chemicals are delivered or blended, the technology delivers real-time, highly accurate measurements of the concentration and temperature of process fluids. Proprietary software enables the user to calibrate the unit for chemical mixtures used in semiconductor laboratory or manufacturing processes. The device is able to monitor up to four separate fluid streams with one digital display unit.