Advantest Boosts Tested Multichip Packages per Hour
Kenji Tsuda, Asia Contributing Editor -- Semiconductor International, 6/16/2008 10:07:00 AM
Advantest Corp. (Tokyo) has developed two new memory testers designed for multichip package (MCP) memory applications; T5781 MCP tester and B2510 burn-in wafer tester for known good die (KGD). The company demonstrated both testers with test handlers at its private show.
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| 1. T5781 multichip package (MCP) tester handles 40,000 MCP/hour. |
The test procedure of the MCP memory can be done with an individual chip using a chip-enable pin, for instance, for each flash memory. After testing of the flash memory chips in completed, a DRAM chip can be tested. Flash memory testing requires a block replacement function when finding a failure block. The T5781 also has that function. Test patterns can be programmed by customers or the company. In the case of an individual measurement of DRAM or NAND flash memory, 768 units can be tested simultaneously.
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| 2. B2510 wafer burn-in tester handles 768 units/hour. |
The burn-in test is done to remove initial defects of DRAM chips using bias-temperature (BT) testing, which requires 5 min. The acceleration test addresses potential defective chips. If a failed chip is identified, it is colored by the system.
Conventional burn-in testers handled only up to 128 chips at a time, and must probe chips on a wafer in five or six passes. Typical DRAM integrates 720-730 chips on a single wafer. The B2510 increases throughput by 5-6×.
To enable these new testing capabilities, Advantest developed GaAs high electron mobility transistors (HEMT) that operate at 20 GHz and are housed in a low temperature co-fired ceramic package.
