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Denso Develops Silicon Carbide Process

Kenji Tsuda, Asia Contributing Editor -- Semiconductor International, 5/27/2008 7:10:00 AM

With hybrid cars as its target, Denso Corp. (Kariya City, Japan) has developed a homegrown compound wafer process and used it to create silicon carbide (SiC) power MOSFETs and Schottky barrier diodes (SBDs).

Intended for cars with electric motors and hybrid drive trains, Denso demonstrated a power module integrating the power MOSFETs and SBDs at the Automotive Engineering Exposition in Yokohama, Japan, organized by the Society of Automotive Engineers of Japan.

Denso demonstrates SiC devices, including (from right) a 3 in. wafer, power MOSFET, SBD, a power module before capping, and a module after capping. The products are aimed at hybrid cars with both electric motors and gasoline engines.

Denso, a tier-one supplier of Toyota Motor Corp. (Toyota City, Japan), produced the 3 in. SiC wafer ingot using vapor phase deposition from a small seed crystal in an atmosphere over 2000°C. Rohm Co. Ltd. (Kyoto, Japan) announced a SiC power MOSFET a week ago based on wafers it purchased from Cree Inc. (Durham, N.C.).

The Denso SiC process features a non-liquid (gas phase) state above the melting temperature point but at a normal pressure, precluding the use of the familiar Czochralski method used in silicon crystal growth. Higher pressure enables liquid crystal growth but requires a more complicated equipment set, leading Denso to use the gas phase growth method. The ingot is sliced into 300-µm-thick wafers.

The prototype MOSFET delivers a 1200 V breakdown voltage and 30-40 A current, and the SBD is rated at a 1200 V breakdown voltage and 200 A of current.

Why SiC? Why not silicon?

SiC features a higher temperature operation than silicon (200°C) as well as a higher breakdown voltage, higher current density and higher switching speed, suitable for automotive applications. The SiC is a wide bandgap semiconductor, stable at temperatures as high as 300°C.

The SBD is connected to a MOSFET in a reverse parallel arrangement. An electric automobile uses three-phase drive motors to rotate wheels, and each motor has three combinations of MOSFETs and SBDs. The prototype devices handle 200 A, but an automotive motor requires 600 V and 400 A as a switching device. The demonstration module includes six 200 A devices (six MOSFETs and six SBDs). Denso plans to develop a 400 A device as the next step.

At the show, Rohm also demonstrated an SiC MOSFET and SBD showing their DC characteristics using a 4 in. SiC wafer.

Toyota announced on May 15 that worldwide cumulative sales of the Toyota Prius — the world's first mass-produced gasoline/electric hybrid vehicle — have passed the 1 million mark. The Prius was introduced in 1997.

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