Test/Burn-In Sockets
-- Semiconductor International, 5/1/2008
The CSP/Micro BGA test and burn-in sockets have been expanded to be used with devices requiring pitches as low as 0.40 mm and higher. These sockets can also be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices. They provide minimal signal loss for higher-bandwidth capability via a signal path of only 1.95 mm, and their solderless, pressure-mount compression spring probes allow them to be easily mounted to, and removed from, the test board. Aries Electronics, Bristol, Pa., www.arieselec.com
