iNEMI Launching Studies of Lead-Free Alloys
Staff -- Semiconductor International, 4/2/2008 8:32:00 AM
The International Electronics Manufacturing Initiative (iNEMI, Herndon, Va.) said it is organizing projects related to lead-free alternatives, adoption of boundary scan technology, and solder paste deposition challenges.
Jim McElroy, CEO of iNEMI, said the consortium seeks to ease the transition to lead-free alloys as suppliers of ball grid array (BGA) packaging search for alloys that provide acceptable mechanical shock performance. Suppliers are also concerned about the high cost of alloys.
Several of these alloys have higher melting points, which may require a change in printed circuit assembly processes. The first phase of the project will focus on the assessment of critical gaps and on driving standards to help manage supply chain risk.
A collaborative study of lead-free alloy failure rates will determine whether a large sample size can reveal lead-free early failures in accelerated thermal fatigue testing. The physical and metallurgical differences between SnPb and lead-free solders have a direct effect on thermal cycle performance, and the properties and failure behavior are markedly different, he said. The team plans to develop a unique test vehicle with a large sample size to test BGA solder joints.
The boundary scan adoption project will promote wider adoption of boundary scan testing and promote the development of tools by automatic test eATE vendors to support boundary scan based-board test. In addition, tools to support boundary scan-based test need to be developed and integrated into manufacturing test equipment, he said, bridging the gap between board test and board manufacturing.
The solder paste deposition project will be organized in China to investigate solutions to depositing different volumes of solder paste on the same board. The project team proposes to investigate the keep-out distances of step stencils and identify new paste deposition technologies for high-density layouts. Also, it will compare and evaluate the feasibility of identified technologies, including the development of new manufacturing processes and equipment.
The consortium is made up of more than 65 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI works to accelerate the deployment of new technology by developing industry infrastructure, establishing standards, and disseminating efficient business practices.
