Electroglas Awarded Patent for Active Vibration Control

Staff -- Semiconductor International, 1/7/2008 6:11:00 AM

Wafer probe supplier Electroglas Inc. (San Jose) said it has received a patent for its proprietary vibration cancellation technology, which enables stable application of the test contactor to a chip’s bond pads.

Called Active Vibration Cancellation (AVC), the Electroglas hardware and software reduces vibrations, which cause poor contacts, resulting in test failures and bonding pad damage. The company said AVC stabilizes contact resistance during the wafer sort process, particularly when wafer probing is performed on a raised floor environment, where vibrations tend to be higher.

The company said it has begun discussions with other companies that may use the technology where precise control of the motion system to the workpiece is required, including MEMS assembly.

Rick Casler, chief technology officer at Electroglas, said the patent opens up “opportunities to grow this new and advanced technology.”