S.E.T. Intros Bonder for 3-D, Nanoimprint
Staff -- Semiconductor International, 11/14/2007 7:37:00 AM
The latest product to result from the partnership between S.E.T. (formerly SUSS MicroTec Device Bonder Division (Waterbury, Conn.) and CEA-Leti (Grenoble, France) is a new high-force device bonder with the flexibility needed for various applications. Francois Marion, senior expert packaging and hybridization, in charge of machine and process development at Leti-Minatec said, "The FC300 will be a key component in our backend process developments, opening the door to:
- Wafer-scale fluxless bump interconnection
- Vacuum hybridization and sealing
- Metal and polymer thermo-imprinting for bump molding and microlens processing
- Polymer ultraviolet (UV) imprinting
Topics, among others that will be developed through a new and exciting three-year joint development program, reinforcing our long collaboration with S.E.T." The bonder includes a built-in chamber for collective reflow in a gas or vacuum environment. Rapid process head reconfiguration allows the FC300 bonder to accommodate different applications on the same platform. At this time, the system is available with automatic handing of chips, templates and small substrate sizes, and will eventually accommodate 300 mm wafers.
High-force (4000 N) applications include Cu-Cu bonding for 3-D IC packaging or nanoimprint using a hot-embossing lithography process. Another option is low-force bonding for reflow of RF and optoelectronic devices. UV curing for adhesive bonding in the UV-NIL process can also be performed.
