Fab Update
-- Semiconductor International, 2/1/2001
300 mm Capacity On Line or Under Construction by Q1 of 2001
Key Points
- Construction and equipment spending for 300 mm fabs in 2001 will reach $10B.
- Intel has more 300 mm capacity under construction or in production than any other company. When fully ramped, it will have a capacity of almost 100,000 wafers a month.
- TSMC has three 300 mm fabs under construction or beginning construction. When fully ramped, these fabs will have a capacity of 80,000 wafers a month.
- Counting its joint-venture fabs, Infineon has four 300 mm fabs either in operation or under construction.
- UMC is equipping its 300 mm fab. Joint-venture fabs are beginning production or starting construction.
- Intel, TSMC, Infineon and UMC will account for over two-thirds of 300 mm capacity by the first quarter of 2003.
Strategic Marketing Associates is a market research company focusing on the fab. For information about capital spending and new fab projects, call Strategic Marketing Associates at 1-831-464-2669.
