Industry Connection
-- Semiconductor International, 2/1/2001
The Institute for Electrical and Electronics Engineers (IEEE), New Jersey Institute of Technology (NJIT) and U.S. Open University (USOU) have teamed up to provide IEEE members with discounts on web-based courses. Members who enroll at USOU, a new non-profit university offering multimedia course materials with faculty support, will receive a 10% discount on tuition for distance learning courses. Members who enroll at NJIT will receive a similar discount on graduate certificate distance learning courses. For further information, visit www.ieee.org.IEEE is soliciting nominations of members for Fellow status. Members "who have made outstanding contributions to the electrical and electronics engineering profession" can be nominated. March 15 is the deadline for receipt of complete nominations. Candidates must be IEEE senior members with five years of service in any grade of membership, whose membership dues are current. Non-members can submit nominations; IEEE Board members, committee members and staff cannot. For further information, visit www.ieee.org.
SEMI has issued a call for papers for the 7th International Electronics Manufacturing Technology (IEMT) Symposium, being held Nov. 12-13 in Santa Clara, Calif. Engineers and scientists can submit a 250-word abstract of an original work pertaining to manufacturing and technology issues associated with leading-edge electronics. Abstracts must be submitted no later than March 30. Manuscripts will be due Aug. 3. Topics include: next-generation portable electronics; optoelectronics; MEMS; high-reliability packaging; environmentally friendly electronics manufacturing; 3-D, thin die and stacked die; internal/embedded passives; rf and high-frequency packaging; high data rate packaging implications; modeling and simulation; manufacturing and yield optimization; product and technology reliability; novel substrates for cost-effective, high-density interconnect; flip-chip and area array packaging (BGA and CSP); flex-based substrates and smart cards; sensor packaging; packaging for medical electronics; reel-to-reel manufacturing and assembly; wafer scale packaging; and integrated design for manufacturing, test, and reliability. For further information, visit www.semi.org
The International Microelectronics and Packaging Society (IMAPS) has moved its headquarters from Reston, Va. to Washington, D.C. IMAPS says the move will enable it to better promote its activities and increase member benefits, adding that the new location is centrally located with access to airports and mass transit. The new address is IMAPS, 611 2nd St., NE, Washington, D.C. 20002. For further information, visit www.imaps.org.
IMAPS has issued a call for papers for IMAPS Brazil, to be held Aug. 1-3 in São Paulo, Brazil. Technical topics may include ball-grid arrays; chip scale packaging; flip-chip technology; fine-pitch soldering; chip-on-board; design process and characterization technology; lead-free developments; conductive adhesives and new inorganic materials developments; quality and reliability; thick-film technology; MEMS; design for manufacturability; economics, marketing and market trends; and technology roadmaps and trends for electronic assembly (personal computer, wireless and telecommunication products). Authors should submit papers, in English, by May 25. For further information, visit www.imaps.org.
