Company News
-- Semiconductor International, 11/1/2000
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Aquafine Corp. (Valencia, Calif.) was named supplier of UV water treatment equipment for Chartered Semiconductor Manufacturing Fab 7 in Singapore. The 200 mm wafer fab features 170,000 ft2 of cleanroom space. The $2.1B fab is expected to be operational by mid-2001. EKC Technology Inc. (Hayward, Calif.) introduced a hydroxylamine free base (HAFB) residue remover, EKC220, to address the worldwide HAFB shortage. Greene, Tweed & Co. (Kulpsville, Pa.) has a sealing technology based on perfluoroelastomer compound, CHEMRAZ, that is featured on its Bonded Slit Valve Door (BSV). It increases the life of the door's seal from 600-800 wafers to 5000 wafers. An audit done by International SEMATECH (Austin, Texas) showed water use at member company fabs has been reduced by as much as 40% since 1997, partially as a result of a rinse water optimization program initiated at the consortium. Survey results show that the average amount of water used in production dropped from 22 to 17 gal/in.2 of silicon after study recommendations were implemented. The ITRS calls for a reduction to 13 gal/in.2 of silicon by 2001 for a state-of-the-art fab. |
