SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Quantum Computing Progress Continues

John Baliga, Associate Editor -- Semiconductor International, 10/1/2000

People have been predicting for years that conventional silicon CMOS technology would hit a wall. Some thought going beyond 1 µm features would be impossible due to lithography limitations, and we are now an order of magnitude beyond that. Some think 100 nm presents another lithography wall; yet phase manipulation techniques have taken research devices to 25 nm using optical lithography. Others think the voltage scaling required beyond 100 nm would make signal indistinguishable from noise at room temperature. So far, transistors have been made using 100 nm features in production ICs, but the practical limits of interconnect performance keep them spaced fairly far apart, limiting crosstalk noise.

Other walls are not far from being reached. Recent work indicates gate dielectrics must be at least four atomic layers thick. Research going back to the late 1980s indicates that using less than ~100 electrons to form a signal pulse or storage bit can be unreliable,1 and current scaling trends will bring CMOS technology to that limit within a couple of decades.

Quantum computing research has been going on for years, initially motivated by the large number of computations possible. Now it is being viewed as a way to extend computing technology after CMOS runs out of steam.

Quantum computing uses quantum states of atoms, quantum wells or quantum dots as bits, rather than collections of electrons. Quantum-level interactions between the atoms, wells or dots are used to compute or communicate. No actual transfer of electrons occurs from one place to another.

Scientists from IBM Research, Stanford University and the University of Calgary have succeeded in making a five quantum bit (Q-bit) computer. It is actually a molecule specially designed so the nuclear spins of five fluorine atoms can interact with each other. The computer was programmed using rf pulses, and the Q-bit states were detected using nuclear magnetic resonance (NMR). The results were reported at the Hot Chips 2000 Conference at Stanford University, sponsored by the IEEE Computer Society.

Though input and output require a great deal of energy in this "computer," and it runs at only 215 Hz, it did demonstrate the feasibility of reducing the number of steps required to perform a specific task. It required only one step to solve an order finding problem, where a conventional approach usually requires as many as four. This may seem like a small improvement, but in a scaled-up system with a large input the difference can be very significant.

The researchers say the first applications for computing systems like these likely would be as coprocessors for specific applications, such as database searches and specific complex mathematical tasks.

It may be possible to use small devices, such as this research device, as multigate or multiterminal devices. Replacing transistors with multiterminal devices is one of the general approaches under examination for future computing systems.2 It may be that circuit topology as well as device technology will have to change in the next two or three decades. 

GaN Growth Processes Improve

Gallium nitride, with a band gap of ~3.44 eV, can be used in LEDs and laser diodes in the blue and green parts of the spectrum, heterostructure devices, and high-temperature devices. Researchers at the Lawrence Berkeley National Laboratory have developed some new techniques for growing high-quality GaN and group III nitride films.

One method uses metallic gallium as a buffer layer to grow GaN films on lattice mismatched substrates, such as sapphire. The buffer is said to provide favorable growth conditions for GaN at higher temperatures for processes such as molecular beam epitaxy (MBE) and metal organic CVD (MOCVD), and it is expected to benefit any group III nitride film growth process.

The researchers also developed a method using bismuth as a surfactant to allow high-quality MBE film growth at lower temperatures. One advantage of the method is that the GaN film can grow as two-dimensional grains that can coalesce, rather than growing individual three-dimensional grains. Another advantage is an increase in the amount of p-type doping possible by using MOCVD. 


REFERENCES
  1. R. W. Keyes, "Miniaturization of Electronics and its Limits," IBM Journal of Research and Development, vol. 32, no. 1 (1988).

  2. T. Shibata, T. Ohmi, "Neural Microelectronics," Technical Digest of the Int. Electron Devices Meeting, 1997, pp. 337-342.


Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

There are no other articles written by this author.

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites