Advanced Interconnect Special Report
-- Semiconductor International, 9/1/2000
Interconnect Continuum Impacts Performance Because it is no longer sufficient to treat chip, package, and board separately, the interconnect continuum must now be managed as a whole.
Interconnection Today
A concise summary of interconnection technology today from the first-level metal on the chip to the end of the board.
Passives Are Getting Smaller and Integrated
Passive devices are a part of any electronic system. With systems continuing to be miniaturized, passives are not only shrinking, but are also being made part of the interconnect system, using much of the same kind of technology.
New Limitations Expose New Trade-offs
As technology progresses, limitations will arise that have never been dealt with before. Borrowing ideas and moving functions from one part of the continuum to the other are ways of seeking opportunity within these limitations.
Optical Technologies Take Interconnects to the Next Level
As electronics reach their speed limit, photonics are breaking the barriers.
