SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Equipment Industry Update

-- Semiconductor International, 9/1/2000

Worldwide Semiconductor Equipment Sales
Shipments Trends for U.S.-Based Manufacturers
Shares of Worldwide Semiconductor Equipment Sales by Product Type
Book-to-Bill Ratios by Equipment Type

Book-to-bill ratios for North American-based semiconductor equipment manufacturers fell for a third straight month in June, according to data compiled by SEMI. But the ratio is coming off a record-high 1.46 in March, so the June number ($1.26 in orders received for every $1.00 shipped) remains strong.

Equipment orders rose 1.1% from May to June, following average gains of 8.1% for January-May. Orders now have increased for nine straight months. Shipments rose at a healthier 3.3% rate in June, yielding the lower book-to-bill ratio.

June shipments were up 72.8% above June 1999. For the first half of 2000, the value of equipment shipped by North American manufacturers was 80.1% above the $6.28B for January-June 1999. At $2.80B in June 2000, orders were almost 70% above the peak of the last cyclical upturn in Fall of 1997.

Worldwide sales for January-May 2000 were 109.7% above the same 1999 period. Growth was impressive across all regions: up 59.1% to North American manufacturers; 86.2% to Japan; 154.0% to Europe; and 155.9% to the rest of the world (mostly to other Asia-Pacific nations). .

Table 1. Equipment Sales Trends by Regional Market
Billions of U.S. dollars % Change from a year ago
TotalProjectedActualProjected
19981999200020011998199920002001
World21.9525.5037.4944.51-20.416.248.98.8
Americas7.627.459.4711.14-16.5-2.226.38.3
Japan4.715.527.198.08-30.517.330.53.0
Europe2.913.244.815.05-5.111.458.06.5
Asia/Pacific6.719.2916.0220.24-22.138.474.812.4
Historical Data: SEMIForecast: Semiconductor International

Table 2. Price Trends
(% Change in producer prices, June 1999-June 2000)
All capital equipment for manufacturing0.8%
All semiconductor manufacturing equipment1.7
Wafer processing equipment1.7
Microlithography-0.4
Etch and strip0.0
Assembly and packaging equipment3.3
Parts for semiconductor mfg. machinery0.0
Source: U.S. Labor Department

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

There are no other articles written by this author.

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs

Podcasts

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites