Erratum
-- Semiconductor International, 8/1/2000
The authorship of two articles in
SI's July special report "300 mm Begins" was listed erroneously. The "Interconnect Deposition" article was written by Joe Hasselbach, Nirmalya Maity and Stuardo Robles, global product managers for Applied Materials' Interconnect Systems and Module Group. The authors of "Thermal Processing: Shrinking Devices on Larger Wafers" were Paul Carey, Ph.D., director of strategic and technical marketing, and Satheesh Kuppurao, Ph.D., global product manager, from Applied Materials' Transistor and Capacitor Group. In the magazine, these bylines were switched.
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