Company News
-- Semiconductor International, 8/1/2000
SpeedFam-IPEC Inc. (Chandler, Ariz.) received a multiple-system, follow-on order for its AvantGaard 776 systems from United Microelectronics Corp. (Hsin-Chu City, Taiwan). The systems will be used to planarize copper films for the production of high-speed logic and ASIC devices at the 0.18 µm design rule.picoTurbo Inc. (Milpitas, Calif.) opened its Taiwan Design Center. The center will provide technical support to existing and new customers in the Asia Pacific region as well as participate in the development of new products.
MKS Instruments Inc. (Andover, Mass.) entered an agreement to acquire Spectra International (Morgan Hill, Calif.), subject to customary closing conditions. The products of both companies will be combined into the MKS Instruments Spectra Products group.
ASML (Tempe, Ariz.) received an initial order from a major U.S. semiconductor manufacturer for its 300 mm lithography systems. The first shipments are scheduled for the third quarter of this year.
Orbotech Ltd. (Yavne, Israel) received a $5.2M order from ASE Materials Inc. The order includes multiple PC-MicroII-S and Vision-309X automated optical inspection systems, VRS-4 verification and repair stations, LP-7008 laser plotter and computer-aided manufacturing software to be used in BGA substrate production operations in Kaoshiung, Taiwan.
GaSonics International Corp. (San Jose, Calif.) is expanding its facilities. The company is adding a new training center, upgrading cleanrooms and improving an existing demo lab at its current location. In addition, corporate headquarters is relocated. The move provides an additional 28,000 ft2 of space to support finance, marketing, sales, human resources and technical support activities.
KDF Electronic & Vacuum Services Inc. (Rockleigh, N.J.) received a multiple order for its 943GT systems from Ericsson Microelectronics. Installation of the systems will be completed by the third quarter in Ericsson's Kista-Stockholm, Sweden facility.
Integrated Measurement Systems, Virtual Test Division (IMS, Beaverton, Ore.), and Agilent Technologies Inc. (Palo Alto, Calif.) formed a distribution agreement to bundle IMS' Digital VirtualTester and TestDirect virtual test software tools with each Agilent 93000 SOC Series and 83000 VLSI Series SoC test system shipped. Under terms of the agreement the software will be sold and supported by IMS.
General Product Devices (GPD, Grand Junction, Colo.) opened its new Asia-Pacific operations office in Chuon-Ho, Taipei Hsien, Taiwan. The facility serves as the customer support and product demonstration center for the Asia-Pacific market.
Leica Microsystems Inc. has moved its North American headquarters to Northbrook, Ill. The company now has split the warehouse/repair depot and headquarters office facilities into two entities.
Ibis Technology Corp. (Danvers, Mass.) received $5M in SIMOX-SOI wafer orders from Bookham Technology. The wafers will be used for the active silicon integrated optical circuits process to manufacture high-quality integrated fiberoptic devices.
Applied Materials Inc. (Santa Clara, Calif.) received multiple orders for its copper wiring equipment set from LSI Logic to create next-generation, copper-based chip designs. The systems are expected to ship to LSI's R&D center in Santa Clara in the second and third quarters of this year. In addition, Applied shipped its 100th Producer system.
Asyst Technologies Inc. (Fremont, Calif.) received a multimillion-dollar order for its SMIF automation technology from Atmel Corp. (San Jose, Calif.). The products will be installed at Atmel's Fab 8 in Irving, Texas, and will be used to manufacture advanced SiGe, BiCMOS, radio frequency, non-volatile, microcontrollers and ASICs with 0.25 and 0.18 µm design rules.
Texas Instruments Inc. (TI, Dallas, Texas) will acquire Burr-Brown Corp. in a stock-for-stock transaction valued at ~$7.6B. Burr-Brown will become part of TI's catalog Analog organization. TI also has reached an agreement to acquire Alantro Communications. TI common stock will be exchanged for all outstanding shares of Alantro for $300M.
Fairchild Semiconductor International (South Portland, Maine) relocated its Mixed Signal Business Unit from San Diego to Carlsbad, Calif. The move provides double the size of the production development lab.
STMicroelectronics (Carrollton, Texas) opened a multimillion-dollar expansion of its silicon chip manufacturing facility in Carrollton. The 32,000 ft2 expansion will mostly be used to support the wireless communications industry.
Credence Systems Corp. (Fremont, Calif.) signed a letter of intent to invest in NewMillennia Solutions Inc. (Irvine, Calif.). The companies will work together to develop a new line of test solutions tailored to high-volume, high-performance ASIC applications.
Tec-Sem (Tagerwilen, Switzerland) and Middlesex (Lugano, Switzerland) formed a strategic alliance to supply material handling solutions for 300 mm, 200 mm and smaller wafers and reticles. Tec-Sem is assuming responsibility for sales and service in Europe and Middlesex for North America. In Asia the companies with share their efforts.
TePla AG (Kirchheim, Munich, Germany) has taken over 100% of IST Instant Surface Technology SA (Yverdon, Switzerland) shares.
