SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Equipment Industry Update

-- Semiconductor International, 7/1/2000

Worldwide Semiconductor Equipment Sales
Shipments Trends for U.S.-based Manufacturers
Shares of Worldwide Semiconductor Equipment Sales by Product Type
Book-to-Bill Ratios by Equipment Type

Book-to-bill ratios for North American-based semiconductor equipment makers fell in April, for the first time in seven months, according to data compiled by SEMI. Orders to equipment manufacturers went up 7.7% from March to April, following a 10.2% rise the month before. April's shipment total was 11.2% above the month before. At more than $2.7B, April 2000 orders to North American equipment makers were 67% higher than during the peak of the industry's previous cyclical upturn in the fall of 1997.

Worldwide sales for January-March 2000 were 102.9% above January-March 1999. Assembly/packaging equipment sales rose 143.0%, wafer manufacturing equipment 139.6%, and test equipment more than 116.0%. Wafer processing equipment sales grew 106.0% in the most recent 12-month period.

The value of semiconductor equipment sold to North American manufacturers was up 46.0% during the first three months of 2000. Sales to Japan were 84.2% higher, and sales to Europe rose 149.1%. Equipment sales to the rest of the world were more than 21/2 times (+156.2%) the level for January-March 1999..

Equipment Sales Trends by Regional Market
Billions of U.S. dollars % Change from a year ago
TotalProjectedActualProjected
19981999200020011998199920002001
World21.9525.5037.4944.51-20.416.247.018.7
Americas7.627.459.4711.14-16.5-2.227.117.7
Japan4.715.527.198.0830.517.330.312.3
Europe2.913.244.815.05-5.111.448.55.1
Asia/Pacific6.719.2916.0220.24-22.138.472.526.3

 

Price Trends
(% Change in producer prices for April 1999-April 2000)
All capital equipment for manufacturing0.6%
All semiconductor manufacturing equipment0.5
Wafer processing equipment-0.4
Microlithography0.0
Etch and strip0.0
Assembly and packaging equipment4.3
Parts for semiconductor mfg. machinery0.0

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

There are no other articles written by this author.

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites