300 mm Wafer Fabs Are Taking Off
-- Semiconductor International, 3/1/2000
Key points:•Of $32B of likely new fab starts from November 1999 to December 2000, 55% or $17.7B will be 300 mm wafer fabs.
•In the U.S., Intel will equip two 300 mm wafer fabs this year.
•In Taiwan, both TSMC and UMC broke ground on 300 mm production fabs in 1999.
•TSMC will have a 300 mm pilot line operational this year and then bring up two 300 mm production fabs within six months of each other.
•Hitachi/UMC will begin equipping their joint-venture production fab this summer.
•By the end of 2003, 15 to 20 300 mm fabs will be in production, equivalent to 40 200 mm fabs.
Strategic Marketing Associates is a market research company focusing on the fab. For information about capital spending and new fab projects, call Strategic Marketing Associates at 1-831-464-2669.
