At a Glance
-- Semiconductor International, 2/1/2000
For high-performance ICs, the package is starting to play a larger role in determining performance and cost. Packages are becoming more efficient in protecting the IC, handling the thermal load and routing more signal connections through smaller spaces. They also are starting to handle power distribution for the chip and house passive devices that ordinarily would take large amounts of board space. Multichip packages and 3-D methods provide effective ways of packing ICs into smaller spaces as well as alternatives to system-on-a-chip integration.
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