2004 Editors' Choice Best Product Awards

The 2004 Grand Award goes to Inficon (East Syracuse, N.Y.) for its FabGuard monitoring system. FabGuard is intended to maximize productivity through increases in overall equipment effectiveness by integrating and analyzing process data for PVD, etch, implant, CVD and diffusion. The sensor integration and analysis system automatically captures, organizes, analyzes and stores valuable data from each tool and in situ sensors. Using sophisticated and robust analyses, FabGuard constantly compares the current run with previous runs, reliably detecting endpoints and faults, while improving process control. If an out-of-spec condition occurs, FabGuard pinpoints the cause and notifies the appropriate person to minimize downtime.

The Swissline 9022 HSL (High Speed Lamination) from Alphasem (Berg, Switzerland) is a film die attach system for 300 mm wafers. It targets cost-sensitive memory applications (DRAM, flash RAM, etc.) that are packaged into leadframe-based lead on chip or substrate-based board on chip. Flexibility and modularity are key features of this platform that allows processing of both epoxy-based applications (TSOP, CSP, BGA, TFBGA, etc.) and film-based target applications.

It features a patented 300 mm wafer handling subsystem with a fast wafer frame adapter exchange and tool-less product changeover in minimal floor space. Multiple pistons compensate for potential thickness variations of process material (die, film and substrate thickness), providing uniform force and lamination that allows multiple die lamination in one step. All parameters (temperature, force, time) are programmable with fixation temperatures up to 250°C. A unique vertical wafer presentation with minimal distance from pick to bond gives very high throughput.

The Black Diamond low-k dielectric film by Applied Materials (Santa Clara, Calif.) is a silicon oxide-based, nitrogen-free PECVD product with k<3.0 for copper damascene interconnects. It does not require subsequent cure or ex situ post-deposition treatment. It exhibits excellent resistance to moisture, stable k value after etching and photoresist removal, good CD control, cracking resistance, thermal conductivity, and sufficient hardness for direct CMP processing and device packaging.

Used in combination with copper's low electrical resistance, this technology offers a range of k values from 3.0 to 2.0 for creating powerful chips with large-scale improvements in speed and power consumption on 200 or 300 mm wafers. The low-k material is in production at multiple sites for 130 and 90 nm nodes.

The IDEALmold System from ASM Technology (Singapore) is an automatic molding system available as standalone, inline, and reel-to-reel units. In the inline format, it features high integration with upstream or downstream IC packaging equipment such as wire bonders, post-mold cure ovens, laser marking, and trim and form systems. Capability extends from mainstream through advanced packages with QFN-singulate design, smart card, pre-mold package, clear epoxy molding and exposed die.

It can handle large leadframe or substrate sizes of up to 75 × 250 mm. Mold cap thickness has been demonstrated at 0.1 mm for QFN, flip-chip and CS-BGA with exposed die. Machine performance is characterized by stability, high yield and high production rates through features such as automatic leadframe/substrate handling with sensors and pattern recognition checks, closed-loop monitoring for continuous process control, offload vision inspection, damage protection to yield loss from foreign debris, and an excellent mean time between assist (MTBA) data range of 4-10 hours.

Equal Channel Angular Extrusion (ECAE) sputtering targets from Honeywell (Sunnyvale, Calif.) are aluminum and copper sputtering targets processed to deliver several enhanced properties. The targets exhibit superfine grain size (reduction in the 10-100× range), extremely homogeneous microstructure, high mechanical strength, and controllable texture. The combined features of ECAE-processed targets result in metallurgical benefits and superior target sputtering performance such as low arcing, extended target lifetimes, and high power sputtering that translate into better film uniformity and low particulates.

ECAE technology is applicable for via fill and blanket film, and has been used in many common aluminum chamber technologies. The ultrafine grain size enables aluminum fill for via applications transitioning to sub-180 nm.

The Stiletto Scanning-Laser Particle Detector from Inficon is an integrated particle monitoring system, featuring an advanced, in situ scanning-laser particle detector with enhanced sensitivity for multi-point monitoring of submicron contaminants in vacuum chambers and pump lines. Stiletto monitors sputter etch chamber conditions for every wafer processed. A minimum detectable particle size of <0.25 mm ensures that "killer defects" will be captured in real time to minimize product loss. Its novel auto-correlation technique virtually eliminates false particle counts.

A fully integrated process monitoring system, the tool can halt the sputter etch process to ensure that no additional product is lost. An easy-to-use interface with the manufacturer's FabGuard Sensor Integration and Analysis System enables synchronized data collection and diagnostics.

The ILS 500S Air Laser Micromachining system from InnoLas GmbH (Berlin) integrates two lasers into a single laser micromachining system. It features a granite structure foundation, a high-power Q-switched solid-state UV laser (355 nm), and an excimer laser (193 and 248 nm). An air-bearing X-Y stage handles up to 150 mm wafers with a travel speed of 500 mm/sec, and four CCD cameras and image processing and vision system provide high-resolution automated workpiece alignment.

The machine includes an endpoint detection system to control the drilling depth of the laser achieved by spectral analysis of the laser-induced plasma during processing. With this device, it is possible to detect thin layers and coatings at the wafer backside without drilling through such coatings, while fully drilling through the rest of the wafer.

TeraStar is a reticle inspection system from KLA-Tencor Corp. (San Jose) designed in response to the increasing use of resolution enhancement techniques (RETs), which extend capability of both 248 and 193 nm lithography systems. The extension of 248 and 193 nm has led to increased mask error factors for printing below the illumination wavelength. This tool inspects the full range of RETs, and may also be used for 90 and 130 nm nodes using a high-resolution UV optical system. The new technology enables maximum yields from complex low-k₁ reticles using triple-beam inspection with synchronous proprietary and pattern inspection algorithms. The algorithms extend linewidth, advanced OPC, and phase-shift mask (PSM) geometries to deliver low false defect rates at higher inspection speeds. The tool is well suited for pre- and post-pelliclization inspection for photomasks, and incoming QC and reticle requalification.

The 2300 Exelan dielectric etch system from Lam Research (Fremont, Calif.) is used for dielectric etch applications on 200 and 300 mm wafers for 180 nm to sub-130 nm nodes. A reactive plasma is confined by semiconductor-grade materials to a small volume around the wafer to create an ultraclean chamber inside the larger process chamber. Ions, electrons and reactive neutral species generated in the plasma are confined while etch byproducts and unreacted gases flow out of the inner chamber. Passivated polymer generated during the etch process is confined in the inner chamber to be removed between process steps by a stripping plasma. The small plasma volume in a confined space allows reactive species to have very short residence times.

Applications include oxide and low-k dual-damascene etch with in situ photoresist stripping and stop layer removal in BEOL processes; and high-aspect-ratio contact, self-aligned contact and borderless contact etch and mask open for gate and isolation trench, spacer and passivation etch for the front end.

The LEO 1540XB CrossBeam system by LEO Electron Microscopy (now the Nanotechnology Systems Division of Carl Zeiss SMT, Oberkochen, Germany) combines ultrahigh-resolution field-emission SEM and focused ion beam (FIB). It is used for making cross sections for failure analysis or development, and preparing TEM lamellas in a bulk wafer at pre-selected positions. The cross sections are used for analyzing layered 3-D structure of complex devices, and the TEM lamellas allow nanoscale structural analysis. The unit offers live SEM imaging capability during FIB operation for research analysis. Options include a multi-channel gas injection system, mass spectrometer, dedicated airlocks, EBSP, EDS, WDS and additional analytical detectors. It features ultrahigh resolution, simultaneous imaging during milling, and fully developed application software.

The PICO vacuum helium leak detector from MKS Instruments Inc. (Andover, Mass.) is a small mass spectrometer-based leak detector that also comes with an optional sniffing probe and battery power for three hours of uninterrupted operation prior to recharge. The leak detector is appropriate for semiconductor tools in etch, CVD, PVD, ion implant and other processes; a typical fab may employ 10-20 leak detectors.

The tools incorporate advanced technology in mass spectrometry and vacuum technology, and can be easily transported to the vacuum system to be leak tested without the need for bulky transport carts. The detector is lightweight (17 lb) and truly portable, and has a rugged design. Features include a minimum detectable leak rate of 10^-10 atm-cc/sec, dual filaments to alert operator when in backup mode, self-protection for turbo pump and mass spectrometer, a display of historical leak rate, quick response and clean-up time, removable hand-held display, and integral vacuum system (turbo/scroll pump).

The Model NPS3301 CMP tool from Nikon Precision Inc. (Belmont, Calif.) is a polishing system used to remove surface topography resulting from the standard deposition techniques of copper, Ta/TaN, and low-k dielectric films. The system enables the integration of fragile ultralow-k dielectrics required for 65 nm devices into multilayer interconnect structures. To achieve this, the tool offers a polish architecture that meets 65 nm process performance requirements at pressures one order of magnitude lower than industry standards. The tool features ultralow polish pressure (0.05 psi), throughput, removal uniformity and planarity performance to meet 65 nm requirements, extension of proven consumable sets, reduced slurry waste, no retaining ring and 10% smaller footprint.

NovaScan 2020Cu (for 200 mm) and NovaScan 3030Cu (for 300 mm) from Nova Measuring Instruments Ltd. (Rehovoth, Israel) provide integrated thickness measurement for dielectric and copper CMP. The systems, used as integrated metrology inside the copper polisher, allow close process monitoring of copper CMP operations, and minimize the need for three different types of standalone tools: profiler for erosion, inspection station for residues, and thickness measurement for remaining oxide. They operate by non-contact, non-intrusive optical measurement technology to measure and detect copper and barrier metal residues, as well as erosion of copper arrays. Inside the polishing process, the systems enable 100% sampling of water, prevent scrap and/or excursion, and monitor the consumables.

The DRP Series Ultrahigh-Purity Fluoropolymer Radial Diaphragm Valve from Swagelok Co. (Solon, Ohio) is designed for use in various applications, including aggressive CMP slurry, acid, chemical, and ultrahigh-purity deionized water delivery systems where flow rate, fluid path, pressure drop, resistance to acid permeation, and diaphragm longevity concerns are relevant. Both standard and custom configurations of the valve adhere to rigorous standards that ensure particulate and metallic contamination remain at ppt levels without aggressive chemical post-cleaning operations. Permeation of corrosive chemicals and flexural fatigue of the valve diaphragm web is mitigated through use of DuPont Teflon PTFE material and finite element analysis of machined fluoropolymer. The valve incorporates computational fluid dynamics to design optimal valve body and diaphragm fluid flow path geometry for CMP slurry distribution systems.

Temperature-compensated piezoelectric substrates from Ziptronix (Morrisville, N.C.) combine low-cost piezoelectric materials such as LiTaO₃ and LiNbO₃ with glass, quartz or other materials that possess a low CTE. The substrate bonding process is achieved on standard equipment at room temperature and ambient pressure with no adhesive. Thus, there is no residual stress or material dislocation and no hazardous waste. The resulting bond is a single, uniform material whose strength exceeds the fracture strength of bonded bulk materials.

In building surface acoustic wave (SAW) filters on these substrates, center frequency drift is reduced to <10 ppm with lower insertion loss and improved noise filtering for communications applications. This is due to the unique ability of piezoelectric materials to convert electrical signals into sound waves that propagate along the surface or through its bulk, and also the inverse — sound waves to electrical signals.