Webcast: Advances in Wafer-Level Packaging
-- Semiconductor International, 10/1/2003
Wednesday, October 1, 2003
Available On-Demand
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Wafer-level packaging is an increasingly attractive, high-performance yet low-cost alternative for a wide variety of chips. This webcast will examine the latest advances in this new technology highlighting design, assembly, test and materials challenges to cost-effective implementation.
Greg Reed will lead a panel of industry experts who will share their experience and explore the following questions:
- What are barriers to widespread adoption of wafer level packaging?
- Will wafer level packaging take place in the fab or in packaging houses?
- What opportunities exist for materials and equipment vendors?
- What opportunities exist for test and process development providers?
- Which wafer level technologies are likely to become mainstream winners?
- Which applications will appear first? Which applications will become high volume?
The panelists will also answer questions from the online audience during a special Q&A session at the end of the program.
Be sure to tune in for this comprehensive exploration of the future of wafer-level packaging,
REGISTER
TODAY.
Moderator
Greg Reed
Executive Editor, Semiconductor International
Panelists
Tom Di Stefano
Decision Track
Phil Marcoux
Executive Director, MEPTEC
Don Horst
Motorola Semiconductor
Sponsors
Webcast Registration Policy
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