2003 Top Fabs

For more than two years now, the semiconductor industry has been experiencing a downturn that differs from those of the past. This time it is being driven not by technology, but by worldwide economic instability. It has been a tough environment to survive in, and spending has been conservative overall. Amid the industry's changing climate, established manufacturers and foundry services have managed to endure and sometimes overcome the industry's cyclical nature. In recognition of their excellence throughout this economic turmoil, Semiconductor International bestows Top Fab honors to one factory and one foundry in recognition of their leadership and perseverance. Intel's Fab 11X is the first high-volume 300 mm factory to successfully use 130 nm process technologies including copper dual-damascene layers. Semiconductor Manufacturing International Corp. (SMIC) has narrowed the technology gap for China's IC industry by rolling out fully qualified 0.35-0.18 µm processes, and becoming one of only a few foundries in the world to offer 0.13 µm copper interconnects — all within a year-and-a-half after equipment move-in.

Intel Fab 11X in Rio Rancho, N.M., manufactures CMOS with more than 20 masking levels, including six copper dual-damascene layers. The facility was established in 2002 and achieved first silicon on 300 mm wafers in the second half of 2002. Production began at ~2200 wafer starts per month and has ramped to ~6600 wafer starts per month. Currently running 130 nm technology, it will transition to a new 90 nm technology beginning in the second half of 2003, and will be 100% converted by the second half of 2004. Intel's 130 nm technology includes resolution-enhanced 248 nm scanners, shallow trench isolation, low-resistance salicide diffusions, advanced dual-damascene copper interconnects, low-k interlayer dielectrics and C4 bump technology. The overall manufacturing area is 733,000 ft² (not including a central utilities building and office space), which includes a 200,000 ft² Class 10 cleanroom.

From its conception, Fab 11X was designed to be a fully optimized, high-volume 300 mm factory. A smooth start-up was accomplished using the company's Copy Exactly! methodology. Copy Exactly! used a combination of technical procedures and operational philosophy to ensure that the fab's process was identically matched to the process developed at Intel's Oregon TD facility. Fab 11X started up on schedule — completing the first 300 mm, 130 nm process transfer of any fab in the world. During production, Fab 11X has maintained quality and yields by deploying a complex set of traditional and advanced process control systems. The focus is on maintaining good controls as well as working continuously to improve process and product parametrics. It has successfully matched 200 mm defect densities on 300 mm wafers. Intel's application of Copy Exactly! enhances quality control and continuous improvement methodologies by carefully controlling engineering parameters and leveraging technical resources at multiple sites.

1. Intel Fab 11X produces high-volume 300 mm wafers using 130 nm process technologies. (Source: Intel)

Fab 11X educates all contractors on cleanroom requirements and establishes extensive standards for operating within its environment. Construction cleanliness is managed through staged protocols that gradually increase contamination controls. The operation uses front-opening unified pods (FOUPs) to contain all production material. Standardized tool loadports prevent material from being exposed to open environments. Three separate contamination levels — non-copper, copper and C4 — are deployed in the factory to prevent material cross-contamination. Software systems, loadport restrictions and visual color-coding throughout the fab ensure that all material is properly isolated.

2. Fab 11X is highly automated — 100% of all wafer movement is mechanized — and features a state-of-the-art automated material handling system with centralized WIP management controls (Source: Intel)

The facility subscribes to the philosophy of an injury and incident-free (IIF) environment, where safety is value-based and all injuries are preventable. If something cannot be done safely, it is not done at all. Extensive training is offered to Intel and contractor personnel. The injury rate is typically below 0.2 injuries per 200,000 manhours of work, both in construction and daily operations.

3. SMIC Fab 1 rolled out fully qualified 0.35-0.18 µm processes within a year-and-a-half after move-in. (Source: SMIC)

Fab 1's progress has significantly narrowed the technology gap between China and leading global players from four to five generations to just one or two generations. Within only one year, Fab 1 rapidly advanced from 0.35 µm process technology to 0.18 µm and finer-line technologies, qualifying numerous logic, mixed-signal and memory products. In line with Fab 1's rapid technology progression, product yields have already attained world-class standards, reaching defect density levels comparable to other top foundry fabs.

All major process and metrology tools are automated through the equipment automation program (EAP). Basic features include user authentication check, automatic lot verification with the manufacturing execution system (MES), automatic recipe ID download from MES to equipment, automatic MES track-in, automatic data collection, and automatic MES track-out. EAPs can perform closed-loop feedback to fine-tune process recipe parameters for next-lot processes, real-time fault detection on equipment or process parameters. In addition, it can also trigger a corresponding action plan, multi-chamber recipe management, equipment alarm ID management, and real-time equipment (or process) data collection. SMIC's EAP has been completely designed in-house and is fully customizable to accommodate all equipment types.

4. After-development inspection station at SMIC Fab 1. (Source: SMIC)

The foundry's point-line-area contamination control philosophy is emphasized and enforced through regulations and standard operating procedures to meet Class 1 or Class 100 particle levels in cleanrooms. This philosophy applies to the ultraclean production area and normal clean supporting areas. The total amount of installation work and number of workers is carefully planned and executed to ensure continuous compliance of cleanroom particle-level monitoring.

SMIC meets local government requirements for establishing the environmental baseline for monitoring soil, ground water, atmosphere and noise. This baseline allows SMIC to objectively assess the fab operation's impact on the environment and take the necessary steps toward environmental accountability. SMIC implements an on-line environmental self-monitoring system and undertakes periodic environmental monitoring performed by the Shanghai Environmental Protection Bureau (SEPB). According to SEPB's monitoring report, SMIC's exhaust pollution levels are significantly lower than the local allowable exhaust standards.

SMIC views safety as a priority and takes preventive measures to avoid potential emergencies. Environment, safety and health (ESH) policies include codes compliant with FMRC (Factory Mutual Research Corp.) and NFPA (National Fire Protection Association), hands-on prevention and protection training for all employees, 24-hour facility monitoring, and review and improvements.

SMIC has been awarded ISO 14001 and 9001 certification. It is in the process of applying for OHSAS 18001 (Occupational Health and Safety Assessment Series), and has initiated environmental management programs to conserve resources, reduce waste and minimize environmental pollution.

In addition to wafer manufacturing services, SMIC offers design services, maskmaking, wafer probing, and outsourced assembly and testing. Design services feature a comprehensive list of IP/libraries coupled with an in-house mask shop, in an effort to reduce customers' time-to-market. SMIC's in-house chip-probing facility provides test program development, wafer probing, failure analysis and turnkey services. The testing facility features a 3000 m² Class 1000 cleanroom that is fully equipped with advanced testing equipment for memory, logic and mixed-signal products. SMIC also provides assembly and testing services through a number of strategic partnerships.

SMIC milestones include offering 0.13 µm copper interconnects; commencement of construction for Beijing, China, facilities with 200 and 300 mm manufacturing capabilities; and partnerships with major chipmakers to manufacture advanced IC products at SMIC's 300 mm production plant in Beijing.