Fab Update: Adding Future Wafer Capacity
Staff -- Semiconductor International, 12/1/2002
Key points:
- Currently announced plans and fabs under construction will add >16% to the industry’s current capacity by 2005.
- TSMC plans to begin equipping Phase 1 of Fab 14, its second 300 mm fab, in 2003, and has two more 300 mm fabs under construction.
- More than 85% of the capacity added by the Top 10 will be 300 mm.
- Five of the Top 10 companies adding capacity are DRAM manufacturers, and they are all adding 300 mm capacity.
- Foundries’ share of existing capacity continues to grow.
- Chinese companies are making their weight felt: Grace Semiconductor is in the Top 10, and SMIC added even more capacity in 2002.
Strategic Marketing Associates is a market research company focusing on the fab. For information about capital spending and new fab projects, call Strategic Marketing Associates at 1-831-464-2669, visit www.scfab.com or e-mail sma@scfab.com.
