2002 Editors' Choice Best Product Awards

Now in its 14th year, Semiconductor International's Editors' Choice Best Product Awards program honors proven semiconductor or related manufacturing products for their excellence. The editors of Semiconductor International recognize products that advance wafer processing, chip assembly, packaging or testing capabilities; enhance semiconductor or related manufacturing; improve employee productivity or working conditions; or aid manufacturers' efforts to provide a safer workplace or environment.

To qualify, products must be nominated by users, not the manufacturer or seller. We urge users to nominate products for next year's program. Eligible products include equipment, materials, software or related products used to manufacture semiconductors, MEMS devices, flat-panel displays or related goods. Further information can be found on our Web site (www.semiconductor.net/awards).

We recognize that competitive advantages are associated with the use of these products. All information provided is kept strictly confidential to allow users to nominate deserving products and give honest opinions.

This year we are pleased to honor 12 exceptional products. The 2002 Grand Award goes to Brooks-PRI Automation for its iConnect e-diagnostics. We congratulate all the winners, presented here in alphabetical order by company.

Grand Award: Brooks-PRI Automation

Grand Award winner: Brooks-PRI Automation, iConnect The iConnect e-diagnostics infrastructure from Brooks-PRI Automation (Chelmsford, Mass.) receives this year's Grand Award. iConnect is a secure, off-the-shelf e-diagnostics solution that reduces unscheduled downtime for equipment suppliers (OEMs) and semiconductor fabs. It provides 24/7 tool equipment performance monitoring for early problem detection and resolution, as well as 24/7 parameter monitoring and trending for predictive maintenance. Other features include remote tool operation and diagnostics for rapid response time and problem resolution, equipment run-time data and performance reports for improved overall equipment effectiveness (OEE), and industry-accepted network and data standards for secure on-line support. Factory experts can remotely troubleshoot and diagnose problems from anywhere in the world without entering the fab. Authentication and authorization are required to access the tools and ensure high security and safety at the tool site. The data collection, storage and visualization features facilitate equipment and process optimization.

Applied Materials Applied Materials, eMAX Centura Dielectric Etch eMAX Centura from Applied Materials (Santa Clara, Calif.) is based on magnetically enhanced reactive ion etch (MERIE) technology. The high-productivity tool is designed for all dielectric processes, but is targeted for critical dielectric etch applications including self-aligned contact, high-aspect-ratio contact, logic contact and dual-damascene etches for 130 nm technologies and beyond. It is an all-in-one system for etching damascene structures in copper interconnects with the lowest-risk approach for low-k integration. The system runs Deposition Mode (polymer-rich) and Clean Mode (polymer-free) steps in separate chambers. Systems are available for 200 and 300 mm wafer processing.

Brooks-PRI Automation Brooks-PRI Automation, EquipeSoft EquipeSoft from Brooks-PRI Automation (Chelmsford, Mass.) is generic system software that controls semiconductor capital equipment. The customer only has to develop the software that is specific to the process its tool performs. EquipeSoft handles all wafer handling and system-level controls, including lot control and scheduling, and factory interfacing to the MES. It enables new process technology to transition to the production line. Its out-of-the-box feature set is much broader and richer. Features include e-mail and paging, Web browsing, user-configurable preventive maintenance, on-line HTML help, throughput monitoring and graphical tools.

Cymer Cymer, NanoLith 7000 NanoLith 7000 193 nm (argon fluoride) excimer laser from Cymer (San Diego) is used in the deep-ultraviolet (DUV) photolithography process. Its 4 kHz repetition rate and maximum 20 W output power enable near-100 nm design nodes, and improve wafer throughput for volume chip production. Higher resolution, critical dimension (CD) uniformity and depth-of-focus (DOF) control are achievable with its line-narrowing module (LNM) and wavelength stabilization module (WSM).

iCADA iCADA, Reticle Storage & Tracking Manager RSM (Reticle Storage & Tracking Manager) software from iCADA (Ludwigshafen, Germany) manages the entire reticle lifecycle within the fab. The RSM tracks and analyzes the complete reticle history (movements, status, inspection, repair, etc.). It integrates easily with reticle stockers and inspection systems of all brands, as well as into the local CIM/MES environment, resulting in increased automation and fewer human errors. The material request queue interfaces with the customer's scheduler, providing smart algorithms for automatic look-ahead inspection and retrieval into both mono- and multi-slot carriers, as well as from carrier storage. Reticles can automatically be sent to inspection and locked when they are contaminated, resulting in less rework and improved yields. The Web interface provides for convenient fabwide access to all relevant reticle data and functions.

INCAM Solutions INCAM Solutions, FOUP for One FOUP for One (FFO) from INCAM Solutions (Grenoble, France) is a single-wafer-capacity front-opening unified pod (FOUP). It is compatible with regular tool interfaces used to transfer wafers from the 25-wafer-capacity FOUP in 300 mm wafer manufacturing. It can store and transport single wafers to and from wafer processing and metrology tools in the front-end fab and back-end probe areas. It supports FOUP ID tags, is compatible with FOUP stockers, and interfaces with SEMI Standard E103 tools. It provides an extremely clean, inert gas-purgeable storage and transportation media for 300 mm (and 200 mm with an INCAM insert) wafers. Wafers need only be sorted and mapped once from the production control area into FFOs prior to entering the fab. Single wafers in FFOs can be brought to tools via OHT, Tracks or PGV, or manually by cart (INCAM's CRT-300-3). The FOUP can be interfaced using INCAM's Load Port Adaptor.

MKS, ASTeX Products MKS, ASTeX Products, LIQUOZON LIQUOZON stand-alone, ozonated water delivery systems from MKS, ASTeX Products (Wilmington, Mass.) deliver ozonated ultrapure water (DIO3) for semiconductor processes. They are available in two models: the LIQUOZON 100 for flow rates up to 30 L/min; and the LIQUOZON XF for extended flow- range operation up to 60 L/min. It is used for critical cleaning including pre-gate clean/pre-diffusion (e.g. organic removal), non-critical cleaning (e.g. photoresist stripping/ashing), and oxide growth applications. It has an ambient safety ozone monitor that will shut off the system in the event of an ozone leak. It allows the highest dissolved ozone concentration up to 90 ppm. The output concentration is closed-loop-controlled, which ensures delivery of a stable ozone concentration even at variable flow. The electrical interface allows connections with up to four tools.

MKS Instruments MKS Instruments, Tru-Flo Tru-Flo mass flow verifier from MKS Instruments (Andover, Mass.) is an in situ, gas panel flow verification device based on the measurement of the rate of pressure rise in a known test volume. It is installed on a gas panel and used to verify that mass flow controllers (MFCs) are maintaining their accuracy and repeatability over time, assuring the user of a stable process. The unit also identifies whether an MFC is still controlling properly when process results appear to be changing, and makes it possible to evaluate the MFC's control in situ. It provides flow verification to ±1% of reading.

SELA SELA, TEMpro TEMpro pre-FIB TEM sample preparation system from SELA (Upper Yokneam, Israel) is used in the analytical laboratory to produce "pre-thins." These pre-thins are then milled in a focused ion beam (FIB) tool to prepare electron-transparent samples for TEM analysis. The system reduces the TEM sample preparation process from hours to minutes. Features include cryogenic sawing for delicate materials (low-k dielectrics), a totally dry process, minimal handling and contact, and a fully supported lamella. TEMpro is a closed system with no reachable moving parts. There are no solvents required for the process. Sample preparation is fast (15 min) and reliable, and does not require any special skills. Samples are free of damage, with no water or chemical contact. The location of the target within the thinned sample edge can be controlled, allowing flexibility of both the FIB process and TEM analysis.

SI Automation SI Automation, SilverBox Software Suite SilverBox Software Suite (SBSS) Global Process Control (GPC) fault detection technology from SI Automation (Montpellier, France) is a methodology based on statistical model and probabilistic criteria that extend the multivariate analysis techniques by automatic fault identification. GPC contributes to the progress of statistics by enabling automatic classification that provides signatures of observations. The product integrates in a single package the logistics and algorithms needed to perform engineering and build advanced process control models, and executes them on-line. The package includes data collection, data monitoring, SPC univariate and GPC. The complete product includes the Process Control Builder (PCB), Process Control Executor (PCE), and Web-based Process Control Viewer (PCV).

Soitec Soitec, UNIBOND SOI wafers UNIBOND SOI wafers from Soitec S.A. (Bernin, France) are engineered silicon products that are used as a starting substrate to replace bulk silicon for IC and nanotechnology manufacturing. The use of SOI substrates eliminates latch-up and reduces parasitic capacitance in CMOS circuits. In nanotechnology, the SOI structure enables substantially more efficient manufacturing techniques to be employed. The wafers are manufactured using Soitec's Smart-Cut technology, which allows the implantation of hydrogen ions with wafer bonding and annealing to form the SOI wafer. UNIBOND wafers are manufactured in all standard wafer diameters (100, 125, 150, 200 and 300 mm) and a wide range of layer thicknesses (both surface silicon and buried oxide) for partially and fully depleted applications. Three product groups are designated: PFD UNIBOND (partially-fully depleted), FD UNIBOND (fully depleted) and UT UNIBOND (ultrathin).

Trebor International Trebor International, Quantum Quantum DI water heater from Trebor International (West Jordan, Utah) is used to evaluate and accurately control the temperature of DI water used in semiconductor wet processes. Its design allows the heater to operate in a particle-neutral condition, eliminating process contamination risk. Trebor's thin film on quartz electric resistive heating technology provides an ultrapure flow path with no elastomer o-ring seals or particle traps. It has Ethernet connectivity for fully functional system control and monitoring. It will not contaminate in the event of a failure, will not trap or generate particles, and responds quickly to process changes.