SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Partners to Speed Yield Ramping Solutions

Laura Peters, Senior Editor -- Semiconductor International, 11/1/2002

The software division of Electroglas Inc. (EGsoft, San Jose), is partnering with International SEMATECH (ISMT, Austin, Texas), Intel (Santa Clara, Calif.) and Texas A&M University (College Station, Texas) to develop a rapid diagnosis and yield ramp solution designed for logic devices.

The software solution aims to expedite the device manufacturer's ability to locate the physical origin of electrical faults in random logic ICs. Initial testing and certification at Intel showed a significant reduction in the time required to identify the physical cause of electrical failures. It works by correlating test, defect and schematic data, bringing a necessary solution for design-to-manufacturing. The project is funded by ISMT.

For additional information on yield management, go to www.semiconductor.net/yield.

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites