Company News
Staff -- Semiconductor International, 9/1/2002
- Electroglas Inc. (San Jose) introduced DefectID automatic defect classification software for productivity and yield improvement during wafer fab, test, assembly and packaging. Working in conjunction with QuickSilver automated wafer inspection systems, the software's algorithms allow consistent, accurate classification of defects on the entire wafer surface without prior knowledge of trouble areas on the wafer.
- FEI Co. (Hillsboro, Ore.) released its Defect Analyzer DualBeam systems for advanced in-fab defect analysis of 130 nm processes on either 200 or 300 mm wafers. The tool provides automated wafer alignment, defect navigation, electron and ion beam imaging as well as ion beam milling for rapid yield learning. It allows root cause analysis of defects detected optically and electrically.
- Researchers from IBM's T.J. Watson Research Lab (Yorktown Heights, N.Y.) and Nion Co. (Kirkland, Wash.) increased the precision of the electron microscope. The researchers used seven new sets of magnetic lenses with state-of-the-art computers to counteract the image-blurring effects of lens aberrations. Real-time aberration correction allows definition of an electron beam only 0.075 nm in size, smaller than a hydrogen atom. Such a microscope can examine, for instance, the bond between silicon and oxygen in silicon dioxide, giving insight into the quality of the insulator.
- IMEC (Leuven, Belgium) has established a reliability center of excellence that builds upon the research center's existing framework in device reliability and failure physics. IMEC collaborates with test equipment companies, semiconductor manufacturers, packaging houses and fabless suppliers. The center focuses on in-depth research in the physics of failure mechanisms, reliability test structures and test methodologies, and built-in reliability.
- Inficon (Syracuse, N.Y.) introduced Stiletto scanning-laser particle detector for real-time, in situ particle monitoring in vacuum chambers and pump lines. Direct interface with the FabGuard sensor integration and analysis system enables synchronized data collection and diagnostics for real-time advanced process control (APC), yield improvement and higher tool productivity. The scanning laser offers a much greater detection area than competing particle monitors, along with autocorrelation capability and advanced signal processing to eliminate false particle counts.
- KLA-Tencor (San Jose) introduced the TeraFlux option for its TeraStar reticle inspection system, which enables the detection of minute, lithographically significant defects on critical contact and via layers during reticle qualification, prior to first-production printing. Designed for 130 nm processes, contact defects on the reticle at this node can image directly on the wafer at full size, whereas such detects were reduced by about one-quarter at previous nodes. KLA-Tencor also introduced new software for its Archer 10 optical overlay metrology system that conducts fully automated, real-time, on-tool overlay metrology analysis.
- Nanometrics Inc. (Milpitas, Calif.) added wafer bow and stress management capability to its NanoSpec thin-film analysis system, eliminating the need to purchase a second metrology tool. Stress-induced cracking and film delaminations are increasing concerns at 300 mm.
- The San Jose-based Straatum business unit of Scientific Systems Ltd. (Dublin, Ireland) introduced an on-line fault detection and classification version of its ImPrint system for tool fault defect classification. The tool uses an impedance fingerprint of the plasma chamber by simultaneously measuring and displaying 15 key electrical parameters including current, voltage and phase of the first five Fourier components of rf power.
- Yield Dynamics Inc. (YDI, Santa Clara, Calif.) formed a strategic relationship with Advanced Micro Devices (AMD, Sunnyvale, Calif.), to market integrated fabwide data storage and analysis products. Integrating YDI's Genesis yield management and engineering data analysis software with AMD's Sapphire database software produces a solution for rapid and comprehensive data collection and analysis.
- Mykrolis Corp. (Billerica, Mass.) opened a new service center in Pudong, Shanghai. The Chinese facility includes sales offices, a customer service center, a pre-wetting liquid filter station and a Class 100 cleanroom for the calibration of mass flow controllers.
- Verteq (Santa Ana, Calif.) sold a Goldfinger Mach2 single-wafer cleaning system to a major IC manufacturer in Asia. The system features Verteq's Sahara STG dry and Goldfinger XT megasonics, and will be used for advanced development of sub-130 nm copper/low-k processes. The system will be configured for both solvent and HF processing with an integral solvent reclaim system. It will ship configured for 200 mm wafers, and is reconfigurable for 300 mm in only a few hours. It is the second unit sold to this customer for the R&D/pilot line.
- Aeronex (San Diego) shipped its 100th Infinity GPS gas purification system in June, within 15 months of its introduction. The system is being used to purify CDA for lens purge in a photolithography tool.
- The Electronic Materials business of Honeywell (Sunnyvale, Calif.) is negotiating an agreement to make Mitsubishi the sole supplier of copper to Honeywell Electronic Materials (HEM), and establish the basis for a long-term partnership to support continuing high-purity copper manufacturing requirements.
- International SEMATECH's (ISMT, Austin, Texas) Interconnect Division transferred its low-k baseline process for 200 mm to ISMT's cleanroom—the Advanced Technology Development Facility—to pilot manufacture one full month ahead of schedule. The low-k baseline dual-damascene process flow, using JSR LKD-5109 porous spin-on dielectric material, will accelerate the efforts of ISMT and its partners to develop low-k solutions for the semiconductor industry. ISMT will qualify the low-k flow on 300 mm wafers by year-end, and is planning a move to 130 nm actual feature sizes in early 2003.
- DuPont (Wilmington, Del.) signed a definitive agreement to acquire ChemFirst Inc. (Jackson, Miss.) in a cash transaction valued at $408M, with a ChemFirst share value of $29.20. ChemFirst's electronic materials business segments will become part of DuPont Electronic Technologies. ChemFirst's chemical intermediates unit, First Chemical Corp., will become part of DuPont Chemical Solutions Enterprise. The acquisition is expected to be completed in the fourth quarter of 2002.
