2001 Editors' Choice Best Product Awards

Since 1989 Semiconductor International has been honoring proven semiconductor or related manufacturing products in our Editors' Choice Best Product Awards program. This program recognizes superior performance of equipment, materials, software and other products that advance wafer processing, chip assembly or packaging, or process testing capabilities; enhance semiconductor or related manufacturing; improve employee productivity or working conditions; or help a manufacturer to provide a safer workplace or to be more environmentally responsible. Semiconductor International chose 20 products used in the semiconductor and related manufacturing industries to honor for excellence.

The program differs from other product awards in that users must nominate products. One or more knowledgeable users nominated all 20 products presented on the following pages, and Semiconductor International's editors used their extensive comments to help choose the winners.

The editorial staff of Semiconductor International congratulates all the winners, presented here in alphabetical order by company. We urge users to nominate products for next year's program. Eligible products include equipment, materials, software or related products used to manufacture semiconductors, MEMS devices, flat-panel displays or related goods. Further information can be found on our Web site.

Semiconductor International recognizes that competitive advantages are associated with the use of these products, and we keep all information provided strictly confidential. Though it is necessary to confirm that valid users nominate products, information obtained will not 

	Grand Award winner – KLA-Tencor Corp., eS20XP

The eS20XP scanning e-beam wafer inspection system from KLA-Tencor (San Jose) was this year's Grand Award winner. Using state-of-the-art voltage contrast capability, it detects electrical defects during front-end processing, inspecting an entire wafer in little more than an hour compared with days required by previous-generation and competitive e-beam systems. Because it enables fab engineers to find electrical defects at the source layer instead of at back-end electrical test, the tool dramatically reduces the risk of weeks or months of work in progress (WIP) to exposure to these yield-killing defects. The eS20XP detects physical defects as small as 50 nm, as well as defects in high-aspect-ratio structures

	Alcatel Vacuum Technology, CPM Etch 2610

Alcatel Vacuum Technology

The CPM Etch 2610 APC tool from Alcatel Vacuum Technology (Annecy, France) is one of a family of chamber pressure management systems for dry etch tools, designed to reduce device defectivity by lowering particulate levels in the process chamber. It is a complete vacuum and abatement system (from the process chamber isolation valve to atmospheric exhaust of treated effluent) with variable speed control that allows process pressure control during etch processing without the use of the isolation valve's throttling function.

	Applied Materials Inc., SACVD process

SACVD (sub-atmospheric chemical vapor deposition) processing from Applied Materials (Santa Clara, Calif.) uses Ozone-TEOS technology to deposit silicon glass (SiO₂) for various front-end gap fill applications. SACVD films are used primarily in pre-metal, inter-metal and STI gap fill applications in advanced memory, flash, and logic devices. SiO₂ films deposited by SACVD have exceptionally low impurities and stress, along with excellent high-aspect-ratio gap fill capability.

	ASM International, Advance A400 Series

ASM International

The Advance A400 Series from ASM International (Bilthoven, Netherlands) is a family of vertical furnaces grouped around two main products: the A400 and A412 furnaces. The A400 supports 200 mm wafers, and the A412 handles both 200 and 300 mm wafers. The furnaces are used in wafer processing for diffusion, oxidation and LPCVD applications. Primary atmospheric applications are dry and wet oxidation, anneal, POCl₃ and BBr₃. The main LPCVD applications are TEOS and poly (doped and undoped), nitride, SHG, DCS- and SiH₄-based HTO, and oxynitride.

	ASM Technology, AB339Eagle

The AB339Eagle automatic gold wire ball bonder from ASM Technology (Singapore) is used to provide the electrical interconnection between die pads to the connecting leads. With an accuracy of ±0.37 µm, it is key in wire bonding processes with ultrafine pad pitch requirements. It has also been improved over its AB339 predecessor with the use of linear motors to minimize maintenance and lightweight bond heads to achieve higher bonding speeds.

CIMConnect and CIM300 from Cimetrix (Salt Lake City) provide the ability for semiconductor equipment to communicate with a factory host. CIMConnect is an object-oriented service toolkit with

	Cimetrix Inc., CIMConnect & CIM300

	Cymer Inc., ELS-6010

The ELS-6010 248 nm 2.5 kHz excimer laser from Cymer (San Diego) is for photolithography applications. Aimed at 130 nm process development and device manufacturing, it has a line-narrowed bandwidth of =0.5 pm FWHM and =1.4 pm at 95% energy, and enables the use of high-NA lenses(>0.70). The laser provides 25% more pulses than 2 kHz systems, dose stability, CD control and high yield.

The Z3MS CVD precursor from Dow Corning (Midland, Mich.) is a versatile, high-performance precursor that is compatible with copper

	Dow Corning Corp.,  Z3MS

	Hitachi America Ltd., Hitachi SCDS

The SCDS catalytic system from Hitachi America (Dallas) is designed for semiconductor PFC abatement. The system features catalytic decomposition technology that produces less waste and has a lower cost of ownership than reclaim combustion or chemical conversion methods. The majority of semiconductor process gases can be abated with better than 99% efficiency. Spent catalyst cartridges are then recycled in steel manufacturing.

Iwaki Walchem

The EH-FF electronic metering pumps from Iwaki Walchem (Holliston, Mass.) allow users to accurately mix, blend

	Iwaki Walchem Corp., EH-FF

	Keithley Instruments Inc., Model 4200-SCS

The Model 4200-SCS semiconductor characterization system from Keithley Instruments (Cleveland) provides lab-grade dc device characterization with real-time plotting and analysis. The instrument structure allows simultaneous measurement of up to eight measurement channels and software that requires only one mouse click to move between tests. The built-in software supports setup, data collection, analysis and data storage. It supports CV meters, switching matrixes and related test equipment. It is available in several configurations for local or remote sense.

	Kinesys Software, ALPS

ALPS wafer map software from Kinesys Software (Petaluma, Calif.) is targeted at inkless assembly applications, providing wafer map data management and equipment integration from wafer sort to die attach. It communicates with production equipment, human users, and proprietary or commercial manufacturing execution systems. Information is collected from the sources, combined and stored in the ALPS relational database and made available on request to the same parties, to support efficient, error-free and traceable production. Information processed includes wafer maps, sort lots, assembly lots, wafer-to-frame relationships, die-level material tracking data, etc.

	Kulicke & Soffa, Maxµm

The Maxµm automatic ball bonder from Kulicke & Soffa (Willow Grove, Pa.) offers 65 msec standard wire cycle speed, which equates to >15 wires/sec. It supports 45 µm production-level process capability. Features include a high-performance X-Y table with 56 × 66 mm bonding, a Precision-Touch bond head with a new Z-axis link, a µT-Sonics ultrasonic transducer and Pro-Pulse wire clamp technology. Its enhanced dual mag ultrafine pitch optics include a standard third programmable LED source for extended illumination, providing die-tilt-tolerant imaging.

	Lam Research Corp., 2300 Versys Silicon

The 2300 Versys Silicon etch system from Lam Research (Fremont, Calif.) is for 200 and 300 mm wafers. Its small-footprint, open-architecture platform handles four process modules and enables advanced factory and process automation. Part of a series that supports all etch applications for sub-130 nm nodes, the Versys Silicon is for in situ waferless auto cleans for high mean time between wet cleans with interferometric endpoint detection optional.

	Numerical Technologies Inc., Virtual Stepper System

The Virtual Stepper System from Numerical Technologies (San Jose) is a photomask qualification tool. It is an integrated software solution that determines the impact of mask defects by separating true defects from nuisance defects. It provides advanced defect printability analysis and mask quality control capabilities, and can be used for through-repair and post-repair verification. Virtual Stepper helps to reduce mask cost and manufacturing cycle time by automating what has been a manual, labor-intensive step in the manufacturing process.

	QC Solutions Inc., QCS-7000 Series

The QCS-7000 Series Surface Charge Profiler from QC Solutions (Billerica, Mass.) is used to monitor the doping concentration (or resistivity) in silicon epitaxial processes. It is an in-line metrology tool that is both non-contact and non-destructive, with high throughput capability. It replaces traditional analytical measurement tools such as CV and 4-point probes, which require that test wafers be scrapped.

	Thermo Nicolet Industrial Solutions, ECO 1000

The ECO 1000 FTIR metrology tool from Thermo Nicolet Industrial Solutions (Madison, Wis.) is a fourth-generation wafer analysis system. It uses a Fourier transform infrared (FTIR) spectrometer designed specifically to enhance the spectroscopic analysis of semiconductor wafers. A dynamically aligned, frictionless bearing interferometer allows users to switch between reflectance and transmission measurements by software command. The system produces multiple point measurements, referenced to either flats or notches, in transmission and reflectance modes using the preprogrammed SEMI standard patterns or a user-defined special pattern.

	Trikon Technologies, Omega 201

The Omega 201 plasma etcher from Trikon Technologies (Newport, UK) is used for a range of critical etch processes in fabricating silicon, III-V and optical waveguide devices. It offers three plasma source technologies on a common hardware set for diverse applications: M0RI, a high-density helicon; plasma-enhanced reactive ion etch (PERIE); and inductively coupled plasma (ICP). The Omega 201 incorporates Trikon's unique electrostatic chuck (ESC), which avoids the use of mechanical clamps that can introduce particles and defects into materials.

	Ultratech Stepper Inc., Model 1600DSA

The Model 1600DSA stepper from Ultratech Stepper (San Jose) is designed for microelectromechanical systems (MEMS), micro-optoelectromechanical systems (MOEMS) or micromachining applications. The tool is equipped with dual-side alignment capability for processing both sides of the wafer. It has 1.0 and 2.0 µm resolution lens options. Features include a high wafer plane irradiance for improved process throughput; process flexibility such as a large depth of focus, non-standard substrate handling, and custom hardware and software for thick resist processing; and the company's machine vision system for flexible alignment capability.

	Veeco Metrology Group, Dimension Vx330

The Dimension Vx330 atomic force profiler (AFP) from Veeco Metrology Group (Santa Barbara, Calif.) is suited to CMP process characterization and production monitoring as well as non-destructive depth measurement of high-aspect-ratio features. The Vx330 AFP mode enables non-destructive automated measurement of dishing, erosion and step height with high resolution, repeatability and accuracy. It complies with relevant standards for fully automated operation in a 300 mm production environment.