Raytheon/Deflex Align for CO2-Based Cleaning
Laura Peters, Senior Editor -- Semiconductor International, 12/1/2001
Deflex Corp. (Valencia, Calif.) and Raytheon Technologies Inc., a subsidiary of Raytheon Co. (Lexington, Mass.), agreed to jointly develop and implement a CO2 stewardship program. The program addresses CO2-based cleaning processes for front-end precision cleaning and CMP as well as assembly, die bonding and dicing processes. It will provide platform CO2 technologies using gas, liquid, solid or supercritical fluid. Deflex also offers extraction and gas purification products and services via its worldwide licensee network.
CO2 cleaning serves as an enhancement or alternative to solvent spray cleaners, vapor degreasers and dryers, ultrasonic and aqueous cleaning systems. The technology aims to improve yield and throughput in the manufacturing process, while providing an environmentally benign alternative to other cleaning methods.
These new technologies employ combinations of dense-phase CO2 with laser, UV, plasma and dry steam adjuncts. The Raytheon/Deflex joint business plan goes beyond the 25 patents currently held in this arena to creation of an extensive intellectual property (IP) platform. The concept consists of taking a CO2-based product or service idea and developing one or more assembly and automation operations through the entire process of design, testing, manufacturing, installation, training and service.
In addition to the Raytheon/Deflex project, Deflex is working with an OEM partner to develop a fully robotic Class 100 parts-cleaning workcell.
For additional information on clean processing, go to www.semiconductor.net/clean.
