300 mm Begins

The long-awaited transition to 300 mm has finally begun, and the industry is developing ways to achieve the 30% or better cost reduction associated with this monumental move. In the midst of 300 mm pilot line activity at a handful of device manufacturers, we asked the recipients of one of Semiconductor International 's Top Fabs awards for 2000 —Infineon and Motorola, architects of the Semiconductor300 fab in Dresden, Germany — to explain the prevailing challenges to 300 mm implementation.

As highlighted in the following feature, "Capability for 300 mm: Approaching Industry Goals," many tools are meeting process goals; but increasing progress in throughput and cost reduction are outstanding issues, especially with respect to automation. Very high levels of tool automation and highly integrated factory CIM systems are required; these are expected to reduce operator personnel levels by 50%. Key areas requiring development activity include step-and-scan lithography for <0.13 µm, in situ metrology, integrated cleans and statistical equipment control.

Though each transition before it certainly was significant, the advancement from 200 mm to 300 mm wafers carries with it the greatest risk and highest cost. (Source: Speedfam-IPEC)

Automation will rely on full implementation of GEM and HSMS protocols, resolution of FOUP reliability issues, and management of intrabay and interbay lot delivery.

In addition to the SC300 feature we present information from tool manufacturers regarding the industry's readiness for 300 mm lithography, metrology, deposition, etch, implant, thermal processing, surface conditioning, CMP and factory automation. Though some share common issues such as reduction of consumables and process uniformity challenges, each has specific concerns as they relate to the technology and bridging the 200 mm/300 mm gap. •