Intel Activates 300 mm Program

-- Semiconductor International, 7/1/1999

Intel Corp. (Santa Clara, Calif.) recently announced it is activating its 300 mm wafer development program. The company plans to start 300 mm production on a 130 nm (0.13 mm) process with copper metallization in 2002, about one year after it begins 130 nm production on 200 mm wafers. The 300 mm technology development will be carried out at Intel's D1C development fab in Hillsboro, Oregon, where equipment installation is scheduled to begin in early 2000.