Company News
-- Semiconductor International, 9/1/1999
GaSonics International Corp. (San
Jose, Calif.) has been awarded several follow-on orders totaling several million
dollars for photoresist removal tools from a leading U.S. chipmaker. The systems
will be used for advanced photoresist removal in the production of 0.18 µm
devices. The orders began shipping in June and will continue through December.
E4 Technologies AG (Zurich,
Switzerland) is a newly formed consulting company that develops concepts for
optimizing running costs in new wafer fabs and cutting costs in existing
semiconductor facilities. The company represents the joint venture of JENOPTIK
AG's subsidiary, M+W Zander and BMG Engineering AG.
Kobe Precision
Inc. (Hayward, Calif.) announced the availability of copper wafer
reclamation services. The reclaim process provides several barriers to prevent
copper cross-contamination risk while removing minimal silicon from the
substrate allowing wafers with copper films to be recycled.
Three-Five Systems Inc. (Tempe,
Ariz.) and Mitsui & Co. Ltd. of Japan completed an agreement where
Mitsui will conduct marketing, sales and distribution in Japan for Three-Five's
advanced display products: LCiD liquid crystal intense display, LCaD liquid
crystal active drive and LCoS liquid crystal on silicon.
Motorola Manufacturing Systems
(Phoenix) announced that the Advanced Test group of Motorola's Semiconductor
Products Sector business unit was transferred to MMS. In addition, MMS received
an order for five Model HDS-1000 high-density BGA/CSP singulation systems from a
leading Taiwan-based IC device assembly company. Terms of the agreement were not
disclosed.
Camstar Systems Inc. (Campbell,
Calif.) announced that Lockheed Martin Fairchild Systems' Imaging Sensor
Operation has selected Camstar's MESA manufacturing execution system for
high-performance imaging sensor product production. The system will be used to
track and control manufacturing of the CCDs as they move through production from
substrate through wafer and chip assembly to complete high-tech camera. Compaq
Computer Corp. also selected Camstar's Windows NT-based InSite manufacturing
execution system for inclusion in its bundled packages for electronics and
back-end semiconductor manufacturing.
Varian Semiconductor Equipment
Associates Inc. (Gloucester, Mass.) announced shipments of its VIISta
single-wafer, high- and medium-current systems to two of the largest
semiconductor manufacturers. The VIISta 80 high-current system is for a U.S.
customer, and the VIISta 810 medium-current system is for a Korean customer.
United States Filter Corp. (Palm
Desert, Calif.) received a $75M, 20-year contract to design, build, operate and
finance a wastewater treatment plant in Woonsocket, R.I. The facility will have
a capacity of 16M gallons per day, and will serve three communities and more
than 100 industrial companies.
SOITEC
(Bernin, France) has completed its new SOI production facility in Bernin and
is operational ahead of schedule. The facility was built in preparation for the
industry's planned shift to SOI material.
ESEC (USA) Inc. (Phoenix)
received an order for $2.7M worth of die bonders from Conexant Systems, Rockwell
International's semiconductor systems spin-off company, for use in production of
semiconductor products for communications electronics. In addition to this
order, June sales included 16 wire bonders, 13 total die bonders and 2 ESEC
AUTOLINE systems.
