SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Swiss Develop Novel High-Resolution Lithography

-- Semiconductor International, 8/1/1999

US Researchers at the IBM Laboratory in Zürich, Switzerland, have developed a fairly simple optical technique that can print features with a size less than half that of the wavelength of the light used. No complex or costly focusing optics are required. A 'light stamp'containing the pattern to be printed is placed directly on the wafer. Instead of the traditional contact lithography using chrome on glass masks, the IBM method uses a rubber-like mask that makes uniform contact with the wafer.

When light strikes the mask, it is guided into the substrate by the protrusions and is blocked or reflected in the recessed regions. Light scatter is minimized by the focusing effect of the protrusions and through the close contact between the stamp and the resist, which have matched refractive indices. Workers have printed lines down to widths of 100 nm (0.1 µm) using a 248 nm KrF excimer laser light source, but the stamp material now in use has too high an absorption at 193 nm and 157 nm for these wavelengths to be tried. They believe it is more important to increase the refractive index of the stamp material to reduce feature size than to reduce the wavelength of the light.

This system does not seem to produce defects or contamination of the wafer, but standing waves in the stamp protrusions can result in interference patterns during exposure. The group claims this contact lithography system has the potential to compete with optical lithography and next-generation techniques, so it might help avoid large investments in the quest for ever finer resolution. IBM is more likely to use it initially for niche applications than high-volume device production. It is said to be much less complex than any of the new lithography techniques.   

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

There are no other articles written by this author.

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs


Sorry, no blogs are active for this topic.

» VIEW ALL BLOGS RSS

Podcasts

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites