Company News
-- Semiconductor International, 8/1/1999
Sizary Ltd. (Migdal Tefen,
Israel) opened its United States subsidiary in Los Gatos, Calif. Dr. Vladimir
Starov has been appointed president of the new firm, Sizary Inc
PRI Automation Inc. (Billerica,
Mass.) received an order from Hitachi Semiconductor Systems Europe GmbH to
automate its semiconductor manufacturing plant based in Landshut, Germany. The
project includes installation of PRI's new high-speed 200 mm products including
TurboStocker 200, Aero Track 200 and TransNet material control software.
Karl Suss
(Munich, Germany) has completed the first installation of the FC150 flip-chip
bonder at North China Research Institute (NCRIEO, Mainland, China). The bonder
will support the institute's optoelectronics work.
Oneac Corp. (Libertyville, Ill.)
announced a partnership with LTX Corp. to supply power conditioning products for
LTX's Fusion system-on-a-chip testers. The power conditioner design includes a
low-impedance transformer that limits peak voltage and edge speed of electrical
transients as well as a grounding methodology that creates a noise-free power
environment.
Electronic Visions Co.
(Scharding, Austria) received an order from Komatsu Electronic Metals Ltd.
(Kanagawa, Japan) for an EV850 SOI bonder. Delivery is scheduled for the second
quarter of this year.
Advanced Surface Technology Inc.
(Billerica, Mass.) has an agreement to acquire Plasma Science line plasma
products from BOC Coating Technology. AST can now augment its surface technology
with a line of plasma systems for cleaning and surface treatment applications.
CVC Inc. (Fremont, Calif.)
shipped its 100th CONNEXION cluster tool system to a leading Japanese
electronics manufacturer. The tool provides a platform for process development
and rapid transfer into production.
Asahi/America
(Maiden, Mass.) announced a three-way alliance with Entegris and Agru of Austria
for automated IR fusion equipment for use with their PurBond PFA piping system.
All parties have characterized the specific welding process of the PFA
components, providing Agru/Asahi America a license for the patented technology.
MIPS Technologies
Inc. (New Orleans, La.) and Chartered Semiconductor Manufacturing
(Milpitas, Calif.) signed an agreement that gives system-on-chip (SOC) designers
access to MIPS processor cores. The alliance gives SOC designers the essential
elements for integrating the processor cores into their products and build
integrated SOC solutions.
Asyst Technologies Inc. (Fremont,
Calif.) received an order valued at more than $4M from Taiwan Semiconductor
Manufacturing Co. (TSMC) for SMIF-LPT load port transfer and SMIF-Enclosure
minienvironment systems. The products will be installed at TSMC's Fab 3, 4 and 5
located in the Hsin-Chu Science Park, Taiwan, to support the manufacture of
logic devices with 0.35 and 0.25 µm design rules.
Advanced Semiconductor Inc. (ASI,
North Hollywood, Calif.) will begin supplying microwave rf semiconductor, which
Motorola has deleted from its line. ASI will ship the parts from a list from
inventory or will manufacture replacements to order to continue the supply for
critical applications.
Ultratech Stepper
Inc. (San Jose, Calif.) received a million-dollar order from a leading
Korean semiconductor manufacturer for the Saturn I stepper system. The system
will be used in conjunction with an existing stepper to produce advanced
semiconductor devices such as digital signal processors and other ASIC devices.
Universal
Instruments (Binghamton, N.Y.) was awarded the Partners in Performance award
by Celestica Inc. The awards were given to suppliers based on their ability to
support supply chain management objectives in flexibility and responsiveness,
impact on asset management, effectiveness and efficiency and overall supplier
performance.
