Ramtron, ULVAC to Enable &nFerroelectrics
Staff -- Semiconductor International, 6/1/1999
Ramtron
International Corporation (Colorado Springs, Colo.) and ULVAC Japan Ltd. (Kanagawa,
Japan) have signed a three-year agreement to develop advanced plasma etching
and metal organic chemical vapor deposition (MOCVD) equipment and process technologies
for ferroelectricrandom access memory
(FRAM) products. The intent is for ULVAC to provide equipment for manufacturers
making devices using Ramtron's FRAM technology.
The agreement is an expansion of the cooperation the companies have had since 1997. Under the terms of the agreement, additional ULVAC processing equipment will be installed at Ramtron's Colorado Springs R&D facility during the fourth quarter of 1999, and ULVAC will station additional technical personnel at Ramtron. The facility is to become the primary demonstration site for ULVAC's ferroelectric processing equipment.
In addition to its development work with ULVAC, Ramtron has FRAM licensing
and manufacturing agreements with a number of semiconductor manufacturers. 
