Technical and business programs
Maria Lester, Associate Editor -- Semiconductor International, 6/1/1999
She
29th annual SEMICON West show, the semiconductor industry's largest conference
and exposition in North America, reflects a progressive recovery from last year's
downturn with sold out exhibitor space and a sizeable waiting list. It is no
wonder that this response reflects optimism when ~35% of total device revenues
and over one-third of production facilities come from the United States.
Since September, the industry has shown a steady recovery, with the North American
growth figures for March approaching a three-year high. The chip equipment market
reported a 14% increase in worldwide bookings and posted a 1.30 book-to-bill
ratio ($130 in orders was received for each $100 products shipped). Encouraging
were reports from an Ernst and Young survey that showed 84% of the respondents
expect the industry's growth rate to return within two years and 49% expect
the market to return within 12 months. 1999's SEMICON West reflects this optimism.
 |
| The test,
assembly and packaging exhibits feature more than 1350 booths representing
560 companies. |
For the third consecutive year, exhibits will be divided between front-end
and back-end processes. The wafer-processing segment will be located at the
Moscone Center and the Yerba Buena Hall, July 12-14, with more than 2800 exhibitor
booths. Overlapping one day is the test, assembly and packaging segment held
at the San Jose Convention Center, July 14-16, with more than 1350 exhibitor
booths. A similar pattern to last year's is expected where SEMI's post-show
analysis indicated 1750 exhibiting companies representing 21 countries, occupying
4502 booths.
Exhibition hours are 10 a.m. to 6 p.m. daily except for the last days of each
show; i.e., on July 14 in San Francisco and July 16 in San Jose, exhibition
hours will be 10 a.m. to 4 p.m. SEMI will provide free shuttle bus service between
San Francisco and San Jose, available throughout the day on Wednesday.
Technical and business
programs
In addition to the exhibition, SEMICON West features more than 40 technical
and business programs, courses and workshops (see Tables 1
and 2). The most popular programs continue
to be the workshop on gas distribution and on contamination in liquid distribution
systems. This year's program has been expanded by adding 13 new programs including
Low-k Dielectric Materials Technology, Copper Interconnect Status, Lithography
Challenges and Opportunities and the Silicon Wafer Symposium. New courses include
Software Inspections, Software Testing, Winning Customer Loyalty Through Customer
Satisfaction and Practical Negotiating Skills for Semiconductor Professionals.
Standards meeting
SEMI International Standards meetings provide a forum for information exchange
between users and suppliers to produce technically accurate specifications and
other standards to the industry. Meetings are open to all at no charge. Schedules
will be available at the Standards Information desk at the San Francisco Marriott
Hotel as well as at the SEMI booths in the Moscone Center (San Francisco) and
Parkside Hall (San Jose). More than 100 committee and task force meetings are
scheduled. In addition, three SEMI Standards technical education programs (STEPs)
and three technical workshops will be featured.
On July 13, the SEMI North American Standards Awards will be presented at
the Standards Award Reception at the San Francisco Marriott Hotel. Award categories
include the Karel Urbanek Award for international achievement in the standards
program, corporate device member, honor, merit, leadership and technical editors'
appreciation. For more information regarding SEMICON West, visit SEMI's web
page, www.semi.org.
Our special Mid-June show extra will include maps, exhibitor lists, new products
and trends that various exhibitors can expect to be in evidence. Expanded coverage
will be provided in the July show issue highlighting show products and providing
an overview of key trends written by Semiconductor International editors.
| Table
1 San Francisco |
| The
following will be held as indicated at the Argent Hotel (AR), San
Francisco Marriott (SFM), Moscone Center (MC) and W Hotel (WH)
|
| July
8 |
| 8
a.m. - 5 p.m. |
Semiconductor
Processing Technology (day 1 of 3) |
AR |
| 8
a.m. - 5 p.m. |
Making
Major Sales(R) (SPIN Selling(R)) (day 1 of 2) |
AR |
| July
9 |
| 8
a.m. - 5 p.m. |
Semiconductor
Processing Technology (day 2 of 3) |
AR |
| 8
a.m. - 5 p.m. |
Making
Major Sales(R) (SPIN Selling(R)) (day 2 of 2) |
AR |
| 8
a.m. - 5 p.m. |
How
to Successfully Manage New Product Introductions (day 1 of 2) |
AR |
| July
10 |
| 8
a.m. - 5 p.m. |
Semiconductor
Processing Technology (day 3 of 3) |
AR |
| 8
a.m. - 5 p.m. |
How
to Successfully Manage New Product Introductions (day 2 of 2) |
AR |
| July
11 |
| 9
a.m. -5 p.m. |
Winning
Customer Loyalty through Customer Satisfaction (day 1 of 2) |
AR |
| 1
p.m. - 5 p.m. |
Workshop
on Gas Distribution |
SFM |
| 1
p.m. - 5 p.m. |
Workshop
on Contamination in Liquid Chemical Distribution Systems |
SFM |
| July
12 |
| 8
a.m. - 12 p.m. |
STEP:
SEMI E-78 (ESD Control) |
SFM |
| 8
a.m. - 12 p.m. |
Design
Practices for Higher Equipment Reliability Tutorial |
AR |
| 8
a.m. - 5 p.m. |
Silicon
Wafer Symposium |
SFM |
| 8
a.m. - 5 p.m. |
Symposium
on Contamination-Free Manufacturing (CFM |
SFM |
| |
for
Semiconductor Processing |
AR |
| 8:30
a.m. - 5:30 p.m |
Lithography
Challenges and Opportunities |
SFM |
| 8:30
a.m. - 5:30 p.m |
Chemical
Vapor Deposition (CVD) for Integrated Circuits Tutorial |
AR |
| 8
a.m. - 5 p.m. |
Environmental
Impact of Process Tools |
SFM |
| 9
a.m. -5 p.m. |
Winning
Customer Loyalty through Customer Satisfaction (day 2 of 2) |
AR |
| 9
a.m. -5 p.m. |
Software
Inspections |
AR |
| 9
a.m. -5 p.m. |
Understanding
& Using Cost of Ownership |
AR |
| 1
p.m. - 5 p.m. |
Low-k
Dielectric Materials Technology |
SFM |
| 1
p.m. - 5 p.m. |
STEP:
Semiconductor Manufacturing Equipment Voltage Sag Immunity |
SFM |
| July
13 |
| 8
a.m. - 12 p.m. |
Copper
Interconnect Status |
SFM |
| 8
a.m. - 5 p.m. |
CMP
Technology for ULSI Interconnection |
SFM |
| 8:30
a.m. - 3 p.m. |
Working
Effectively w/Asia: Cross-Cultural Awareness & Skills |
AR |
| 8:30
a.m. - 11:30 a.m. |
Equipment
& Materials Market Briefing |
MC |
| 9
a.m. - 5 p.m. |
Software
Testing |
AR |
| 9
a.m. - 5 p.m. |
Overall
Equipment Effectiveness: Improving Equipment Productivity |
AR |
| 10
a.m. - 12 p.m. |
CGMG
General Meeting |
SFM |
| 1
p.m. - 5 p.m. |
Resolution
Enhancement Technologies in Optical Lithography Tutorial |
SFM |
| 1
p.m. - 5 p.m. |
Wafer
Fab Design: Current & Future Challenges |
SFM |
| 1
p.m. - 5 p.m. |
Forecasting
Techniques for the SEM Industry |
MC |
| 3
p.m. - 6 p.m. |
EHS
Interest Group Meeting |
SFM |
| July
14 |
| 8
a.m. - 12 p.m. |
Resolution
Enhancement Technologies in Optical Lithography Tutorial |
SFM |
| 8
a.m. - 3 p.m. |
CIM
Framework |
SFM |
| 8
a.m. - 3 p.m. |
Flat
Panel Display Manufacturing Technology Conference |
SFM |
| 8
a.m. - 12 p.m. |
STEP:
Sensor Bus Technology |
SFM |
| 8:30
a.m. - 3:30 p.m. |
Semiconductor
Industry/Education Partnerships: |
|
| |
Shaping
a New Workforce for the 21st Century |
WH |
| 1
p.m. - 5 p.m. |
MEMS
Manufacturing Challenges |
SFM |
|
| Table
2 San Jose |
The
following will be held as indicated at the San Jose Hilton and Towers
(HT),
San Jose Fairmont Hotel (FH) and Convention Center (CC)
|
| July
13 |
| 8:30
a.m. - 5:30 p.m. |
Advanced
Packaging Technologies Tutorial (day 1 of 2) |
HT |
| 9
a.m. -5 p.m. |
2nd
Annual Semiconductor Packaging Symposium (day 1 of 2) |
|
| |
(8
parallel sessions) |
HT |
| July
14 |
| 8:30
a.m. - 5:30 p.m. |
Advanced
Packaging Technologies Tutorial (day 2 of 2) |
HT |
| 9
a.m. - 5 p.m. |
2nd
Annual Semiconductor Packaging Symposium (day 2 of 2 |
|
| |
(8
parallel sessions) |
HT |
| July
15 |
| 8
a.m. - 5 p.m. |
Semiconductor
Processing Technology (day 1 of 3) |
FH |
| 8
a.m. - 5 p.m. |
IC
Trends, Packaging & Testing Issues: |
|
| |
An
Introduction for Test Engineers Tutorial |
FH |
| 8
a.m. - 5 p.m. |
Practical
Negotiation Skills for Semiconductor Professionals |
FH |
| 8:30
a.m. - 5 p.m. |
International
Packaging Strategy Symposium |
HT |
| 8:30
a.m. - 9:30 a.m. |
Equipment
& Materials Market Briefing |
CC |
| 8:30
a.m. - 12:30 p.m. |
8th
Annual Manufacturing Test Conference |
HT |
| 9
a.m. - 5 p.m. |
Understanding
& Using Cost of Ownership |
FH |
| 1
p.m. - 5 p.m. |
Test,
Assembly & Packaging Vision Conference |
HT |
| July
16 |
| 8
a.m. - 5 p.m. |
Semiconductor
Processing Technology (day 2 of 3) |
HT |
| 8:30
a.m. - 5 p.m. |
Flip
Chip Technologies Tutorial |
FH |
| July
17 |
| 8
a.m.-5p.m. |
Semiconductor
Processing Technology (day 3 of 3) |
|
| This
schedule is accurate as of April 22. |
|