SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

North American Book-to-Bill Reaches 1.10

Staff -- Semiconductor International, 4/1/1999

North American Book-to-Bill
Month Shipments
($ million)
Bookings
($ million)
Book-to-Bill
August 98 1011.8 571.6 0.57
September 98 845.7 481.3 0.57
October 98 852.3 638.0 0.75
November 98 (final) 931.6 767.2 0.84
December 98 (revised) 895.2 869.2 0.97
January 99 (preliminary) 868.0 957.7 1.10
Semiconductor Equipment and Materials International (SEMI, Mountain View, Calif.) reported that the North American semiconductor equipment industry posted a book-to-bill ratio of 1.10 for January 1999. This marks the first time North American equipment bookings have exceeded shipments since November 1997.

"This is the fourth month of sequentially greater order levels. Continuing improvement in semiconductor equipment booking figures convey further optimism for the equipment industry," said Stanley Myers, president of SEMI. "While we have not seen a rash of announcements for new semiconductor facilities to be built in 1999 and 2000, the January order level indicates that aggressive activity in both fab conversions and backend upgrades for the newest chip designs should continue to improve equipment industry business levels in 1999."

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs


Sorry, no blogs are active for this topic.

» VIEW ALL BLOGS RSS

Podcasts

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites