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SEMICON Europa 99 Moves to Munich

Lisa J. Chamberlain, Staff Editor -- Semiconductor International, 4/1/1999

After spending six years in Geneva, SEMICON Europa will be held at the New Munich Trade Fair Centre, Munich, Germany, April 13-15. The new location is expected to benefit exhibitors by its central location, modern facilities and accommodations for future growth.

Table 1. Programs/Events
April 12 8:30 a.m.-5:30 p.m. International Conference on MST/MEMs
8:30 a.m.-5:30 p.m.

Manufacturing Test Conference

9 a.m.-5 p.m. Chemical Vapor Deposition (CVD) for Integrated Circuits
9 a.m.-5 p.m. Overall Equipment Effectiveness (OEE): Improving Equipment Productivity
9 a.m.-5 p.m. SECS/GEM Implementation
9 a.m.-5 p.m. Advanced Packaging Technologies
1:30-5:30 p.m. Simplification of Semiconductor Processing - A Key to Future Success Conference
April 13 8:30 a.m.-12:30 p.m.

Simplification of Semiconductor Processing - A Key to Future Success Conference

9 a.m.-5 p.m. SECS/GEM Implementation
9 a.m.-5 p.m. Advanced Packaging Technologies
1-4:30 p.m. Advanced Optical Lithography
1:30-5 p.m. Semiconductor Equipment Assessment (SEA): 'Bridging Innovation-Productivity Gap to the Next Millennium'
1:30-5:30 p.m. Silane Safety Seminar
April 14 8:30 a.m.-12 p.m. Chemical Mechanical Polishing Conference
8:30 a.m.-12 p.m. Plasma Damage Conference
8:30 a.m.-5:30 p.m. Equipment Automation & Integration Conference
9 a.m.-5 p.m. Semiconductor Processing Technology
9 a.m.-5 p.m. Understanding and Using Cost of Ownership
9 a.m.-5 p.m. Competitive Marketing Strategy: The Lanchester Equation
12:30-1:30 p.m. SEMI International Standards Overview
1-4:30 p.m. Particle Contamination and Monitoring Conference
1-4:30 p.m. Advanced Interconnects Conference
1-5 p.m. Software Management for Senior Exectives
1-5:30 p.m. Packaging for Portable Telecom Applications
April 15 8 a.m.-5 p.m. How to Successfully Manage New Product Introduction
8:30-9:45 a.m. Market Briefing Forum
8:30 a.m.-12:30 p.m. STEP: SEMI S2, Safety Guidelines for Semiconductor Manufacturing Equipment
8:30 a.m.-3 p.m. International Packaging Strategy Symposium (IPSS)
8:30 a.m.-5:30 p.m. 1999 European Contamination Control Conference - The Event with the Answers
9 a.m.-5 p.m.

Semiconductor Processing Technology

1:30-5:30 p.m.

STEP: Advanced Factory Communication (CIM Systems)

April 16 8 a.m.-5 p.m. How to Successfully Manage New Product Introduction
9 a.m.-5 p.m. Flip Chip Technologies
9 a.m.-6:30 p.m. Fab Management Forum, Dresden, Germany
More than 4500 visitors from around the world are expected to attend the 24th annual event, including over 900 exhibitors in 1700 booths. Exhibitors from Austria, Belarus, Belgium, England, Finland, France, Germany, Hungary, Ireland, Israel, Italy, Japan, Korea, Luxembourg, The Netherlands, Russia, Singapore, Sweden, Switzerland, Ukraine and the United States will be present. True to its intended purpose of promoting international business, learning and networking opportunities for semiconductor equipment, material and service suppliers, the conference will feature technical programs, business/marketing programs, international standards meetings and networking opportunities with business leaders from around the world. Programs and events are listed in Table 1.

The SEMICON Europa 99 Test Conference will be held April 12, the day before the exhibition. It will address new challenges in semiconductor manufacturing testing technologies. Other topics planned for the conference include microelectromechanical systems (MEMs), advanced packaging technologies, lithography, chemical vapor deposition (CVD), plasma damage, interconnect technology issues, automation and a conference on semiconductor manufacturing cleanrooms.

Semiconductor test issues will serve as the major emphasis of the show. The exposition will feature an expanded conference on semiconductor test issues and a pavilion dedicated to companies exhibiting the latest test equipment, products and services. The Test Pavilion will occupy hall A2 of the trade center and is expected to host over 100 test-specific exhibit booths.

The SEMInvest conference will be held in conjunction with the exposition, on April 13, to facilitate communication between the semiconductor equipment and materials industries and the institutional investment industry. It aims to support the capital formation and investment relations requirements of SEMI member companies.

For more information on SEMICON Europa 99, visit the SEMI web page at www.semi.org. Information about the New Munich Trade Fair Centre can be found at www.messe. muenchen.de, and general information about Munich can be found at www.muenche-tourist.de.

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