Amkor Technology Invests in& New Taiwan Semiconductor Packaging Joint Venture

Staff -- Semiconductor International, 12/1/1998

Amkor Technology Inc. plans to invest an estimated $40 million over the next two years in a new Taiwan packaging joint venture, Taiwan Semiconductor Technology Corp. (TSTC). TSTC will provide independent advanced IC packaging foundry services primarily for the Taiwan market and Taiwan wafer foundry output.

Facilitation of the initial plant in Linkou, near Taipei, is underway. Manufacturing is scheduled to begin in the first quarter of 1999. Amkor plans to support TSTC by providing more advanced Ball Grid Array (BGA) and Chip Scale Package (CSP) technology.