SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Europe to Develop Field Emission Backlight

Staff -- Semiconductor International, 9/1/1998

United Kingdom T he goal of the European ESPRIT long-term research project "FEDLIT" is to develop a 20,000 cd/m2, 50 mm X 50 mm field emission backlight. The field emission technology using diamond-like carbon is being developed by the Engineering Department of the University of Cambridge (Cambridge, England). Diamond-like carbon is a broad-area electron emitter that can be deposited directly onto glass substrates at room temperature. In due course it is expected that this method will result in far lower manufacturing costs than the Spindt tip silicon production approach now used by other field emitter display manufacturers. The potential advantages of the backlight technology, as compared with current techniques, include very high brightness, a thin profile and an extended operating temperature range.

CRL (formerly the Central Research Laboratories, Hayes, England) is collaborating in this project with Sextant Avionique (France), which plans to use the backlights in its range of liquid crystal displays for aircraft cockpits. CRL expects that the technology also will be applicable to commercial outdoor bright backlights and as pixel elements for very large, bright, outdoor displays. According to a company representative, opportunities exist for partner companies to work with it on such applications.

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs


Sorry, no blogs are active for this topic.

» VIEW ALL BLOGS RSS

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites