Phototronics Joins IMEC's Optical Lithography Program

Staff -- Semiconductor International, 10/1/1998

Photronics (Brookfield, Conn.) and IMEC (Leuven, Belgium) announced a cooperative agreement to explore and develop photomask manufacturing technologies and processes needed to produce integrated circuits with features down to and below 130 nm (0.13 µm). A key area of focus will be determining reticle technology requirements for using 193 nm lithography to produce 130 nm designs. The agreement outlines the roles and each organization's responsibilities as participants in IMEC's Industrial Affiliation Program on Optical Lithography (IAPOL) and names Photronics as a "Preferred Photomask Supplier."

IMEC has collaborated with ~ 420 companies and institutions that provide systems, semiconductors, equipment and services to the global microelectronics market. Photronics is the first photomask manufacturer to join the IAPOL program.

IAPOL is a joint research project focusing on a number of specific goals. One is the enhancement of critical dimension (CD) uniformity on the wafer using reticle enhancements, such as optical proximity correction (OPC) and phase shifting. Another is the evaluation of available materials and manufacturing systems. The program also will evaluate available reticle inspection tools and repair systems and wet and dry etch process technologies. They also will identify limits of optical CD metrology technologies and defect printability at and below the 180 nm technology node.