New on SI's Web Site: Exclusive Features

exclusive feature articles that

Peter Singer, Editor-in-Chief -- Semiconductor International, 10/1/1998

This month, we are publishing four "Web Exclusive" articles. We think you'll agree that the following are well worth a click on the Web Exclusive icon on our home page.

Semiconductor Manufacturing "Post-Fab" Changes by Joseph LaChapelle, Electroglas Inc., Inspection Products Division. According to LaChapelle, the post-fab area of the semiconductor manufacturing process must change to keep pace with the latest IC developments: faster, denser chips that integrate more functionality than prior generations; die with more bond pads on tighter pitches than in the past and an assortment of new packages that rely on solder-bumped bond pads. The move to larger wafers, which brings with it a redesign of virtually every piece of equipment in fab and assembly, provides an opportunity to adapt to changes brought about by these chip developments.

Next Generation Dopant Development and Characterization by L. Wang, M. Donatucci and M. Todd, ATMI, NovaSource, Danbury, Conn. In research at ATMI, several antimony, germanium and clustered boron dopants were developed or evaluated for ion implantation applications. The properties of the new materials were characterized, and some have been alpha tested in implanters.

Optimization of Air Flow Patterns in the ZETA Minienvironment Using CFD by Moshe Olim, FSI International. This article describes how, in designing the recently introduced ZETA surface conditions system, computational flow dynamics (CFD) were used to minimize nonlaminar flow regions in the minienvironment. The data generated by the CFD solver are visualized using streaklines that show air flow.

Finally, in a case study written by Motorola engineers on High Removal Efficiency Water Scrubbers, J. Michael Sherer and James Swauger describe a long-term program that replaced existing centralized water scrubbers that were aging. These water scrubbers were located on the roof, servicing semiconductor processes in several wafer fabs.

Summaries of future "Web Exclusive" articles along with other web information will be provided in subsequent issues on a page immediately following our feature article section.

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