Toshiba to Outsource Manufacturing Processes
Staff -- Semiconductor International, 6/1/1998
Toshiba Corp. (Tokyo, Japan) decided to outsource parts of its semiconductor manufacturing. The company has announced its intention to outsource ~40% of the processes to other companies by 2000, cutting costs and insulating itself from volatile chip prices. Some of processes will be farmed out to Winbond Electronics Corp. (Taiwan), and others to Dominion Semiconductor L.L.C., a joint venture Toshiba has with IBM in Virginia. Winbond and Dominion will imprint the circuits on the wafers, with Toshiba completing the process.
