SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

EUV LLC Enters Development Agreement With Newly Formed U.S. Advanced Lithography

Staff -- Semiconductor International, 7/1/1998

EUV LLC Enters Development Agreement
With Newly Formed U.S. Advanced Lithography

The newly formed United States Advanced Lithography Limited Liability Company (USAL, San Jose, Calif.) entered into a non-exclusive agreement with the Extreme Ultraviolet Limited Liability Company (EUV LLC, Santa Clara, Calif.) to develop EUV lithography tools. The alliance is the second such agreement made by the EUV LLC to license the development function of the EUV lithography effort to a U.S.-based lithography company.

USAL was formed by Ultratech Stepper (San Jose, Calif.) to help U.S. equipment manufacturers strengthen and expand their competitiveness in the world economy by producing the EUV tools in America. It is the first company to focus solely on post-optical lithography, and additional participants are expected to join. Intel (Santa Clara, Calif.), Motorola (Austin, Texas) and Advanced Micro Devices (AMD, Sunnyvale, Calif.) founded EUV LLC to fund continued EUV lithography research and to commercialize the technology with early access for the EUV LLC participating companies.

The EUV LLC and its member companies have been aggressively developing EUV technology in a CRADA partnership with the Virtual National Laboratory, which has been formed among representatives from Lawrence Livermore (Livermore, Calif.), Lawrence Berkeley (Berkeley, Calif.) and Sandia National Laboratories (Albuquerque, N.M.).

Commenting on the agreement with USAL, Director of EUV LLC Business Programs Sander H. Wilson noted, "USAL's participation is logical and welcomed since Ultratech has been an early participant and advocate of this technology. The program will definitely benefit from USAL's participation." According to EUV LLC officials, the proof of concept test system for EUV lithography will be built at Sandia National Laboratories over the next two years and will be used to demonstrate the lithographic potential of the technology.

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs


Sorry, no blogs are active for this topic.

» VIEW ALL BLOGS RSS

Podcasts

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites